Applied Materials, Inc. (20240307963). METHODS FOR UPPER PLATEN MANUFACTURING simplified abstract

METHODS FOR UPPER PLATEN MANUFACTURING

Organization Name

Applied Materials, Inc.

Inventor(s)

Ximeng Xue of Santa Clara CA (US)

David J. Lischka of Austin TX (US)

Jay Gurusamy of Santa Clara CA (US)

Steven M. Zuniga of Soquel CA (US)

Jeonghoon Oh of Saratoga CA (US)

Jagan Rangarajan of San Jose CA (US)

METHODS FOR UPPER PLATEN MANUFACTURING - A simplified explanation of the abstract

This abstract first appeared for US patent application 20240307963 titled 'METHODS FOR UPPER PLATEN MANUFACTURING

Simplified Explanation

This patent application describes a method and apparatus for additive manufacturing of a component for a semiconductor processing apparatus. The method involves selectively depositing layers to build the component, including creating cooling channels filled with a filler material.

• The apparatus includes a printhead that deposits layers to build the component.
• Cooling channels are formed by depositing a second set of layers with gaps.
• The cooling channels are filled with a filler material and covered with additional layers.
• A liquidizing agent reacts with the filler material to produce an effluent fluid that is drained.

Key Features and Innovation

• Selective deposition of layers to build a component for a semiconductor processing apparatus.
• Creation of cooling channels within the component using a filler material.
• Use of a liquidizing agent to remove the filler material and create cooling channels within the component.

Potential Applications

This technology can be applied in the manufacturing of components for semiconductor processing apparatus, where efficient cooling is essential for optimal performance.

Problems Solved

This technology addresses the challenge of efficiently cooling components in semiconductor processing apparatus by creating cooling channels within the component.

Benefits

• Improved cooling efficiency in semiconductor processing apparatus.
• Enhanced performance and longevity of components.
• Cost-effective manufacturing process for complex components.

Commercial Applications

• Semiconductor industry for manufacturing processing apparatus components.
• Additive manufacturing companies for producing specialized components.
• Research institutions for developing advanced cooling solutions.

Prior Art

Prior art related to this technology may include patents or research papers on additive manufacturing methods for semiconductor components with integrated cooling channels.

Frequently Updated Research

Research on additive manufacturing techniques for semiconductor components and cooling solutions is continuously evolving. Stay updated on the latest advancements in this field.

Questions about Additive Manufacturing of Semiconductor Components

How does the use of a liquidizing agent improve the efficiency of cooling channels in semiconductor components?

The liquidizing agent reacts with the filler material to remove it, creating clear cooling channels for improved heat dissipation.

What are the potential challenges in implementing this additive manufacturing method for semiconductor components on an industrial scale?

Challenges may include optimizing the deposition process, ensuring uniform cooling channel distribution, and scaling up production while maintaining quality standards.

Original Abstract Submitted

embodiments of the disclosure provided herein include an apparatus and method for additive manufacturing a component for a semiconductor processing apparatus. the apparatus for additive manufacturing includes a printhead configured to selectively deposit layers on build the component, wherein the printhead may selectively deposit a first set of layers onto the build platform, and selectively deposit a second set of layers on the first set of layers, each of the second set of layers comprising a gap that forms a cooling channel through the component. the cooling channel is filled a filler material. a third set of layers covers the cooling channel before the channel is exposed to a liquidizing agent, wherein the liquidizing agent reacts with the filler material to produce an effluent fluid which is then drained. in other embodiments, the cooling channel may be machined into the component before being filled with the filler material.