Apple inc. (20250004501). SEALED COMPONENTS FOR HEAT MANAGEMENT AND GROUNDING
Contents
SEALED COMPONENTS FOR HEAT MANAGEMENT AND GROUNDING
Organization Name
Inventor(s)
Edward S. Huo of Sunnyvale CA US
Anthony S. Montevirgen of Redwood City CA US
SEALED COMPONENTS FOR HEAT MANAGEMENT AND GROUNDING
This abstract first appeared for US patent application 20250004501 titled 'SEALED COMPONENTS FOR HEAT MANAGEMENT AND GROUNDING
Original Abstract Submitted
a head-mountable device () can include electronic circuits, such as cameras (), sensors (), and input/output devices. the head-mountable device can secure such electronic circuits with an assembly that also provides thermal dissipation, electrical grounding, and a sealed chamber () to isolate the electronic circuit from ingress of debris. the assembly can provide a degree of mobility, where desired. accordingly, the electronic circuit can operate more optimally and with lower risk of degradation and interference with other components of the head-mountable device.
