Apple inc. (20240357734). Eddy Current Mitigation for On-Chip Inductors simplified abstract
Contents
Eddy Current Mitigation for On-Chip Inductors
Organization Name
Inventor(s)
Behzad Biglarbegian of San Jose CA (US)
Hongrui Wang of San Jose CA (US)
Abbas Komijani of Mountain View CA (US)
Reetika K Agarwal of San Jose CA (US)
Eddy Current Mitigation for On-Chip Inductors - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240357734 titled 'Eddy Current Mitigation for On-Chip Inductors
Simplified Explanation: The patent application describes an electronic device with a transceiver that includes various components patterned onto a substrate to convey signals effectively.
Key Features and Innovation:
- Transceiver with inductor and ground traces for signal transmission.
- Circuit components arranged in trees with feed lines for efficient signal conveyance.
- Components used for bypass capacitors, power supply lines, and other functions within the transceiver.
- Components meet fill factor requirements for substrate fabrication.
Potential Applications: The technology can be applied in various electronic devices such as smartphones, IoT devices, and communication systems.
Problems Solved: The technology addresses the need for efficient signal transmission and component arrangement in electronic devices.
Benefits:
- Improved signal transmission efficiency.
- Enhanced functionality of electronic devices.
- Meeting fill factor requirements for substrate fabrication.
Commercial Applications: The technology can be utilized in the telecommunications industry, consumer electronics sector, and other fields requiring efficient signal transmission.
Prior Art: Readers can explore prior patents related to signal transmission components, inductors, and substrate fabrication in electronic devices.
Frequently Updated Research: Stay updated on advancements in signal transmission technologies, substrate fabrication methods, and electronic device design principles.
Questions about Electronic Devices with Transceivers: 1. How does the arrangement of components in trees improve signal transmission efficiency? 2. What are the key factors to consider when designing bypass capacitors for power supply lines in electronic devices?
Original Abstract Submitted
an electronic device may include a transceiver with a substrate and an inductor on the substrate. a ring of ground traces may surround the inductor. circuit components may be patterned onto the substrate overlapping the inductor, a region of the substrate surrounded by the inductor, and/or a region of the substrate between the inductor and the ring. the components may be arranged in trees with feed lines extending radially outward from a central axis. the components in each tree may be separated from the capacitors in other trees by gaps, preventing eddy currents on the trees. the components may be used to form bypass capacitors for power supply lines, a low-dropout regulator load, part of the loop filter of a phase-locked loop, or other portions of the transceiver. the components may thereby be used to convey signals while also meeting fill factor requirements associated with fabrication of the substrate.
