Apple inc. (20240357733). Eddy Current Mitigation for On-Chip Inductors simplified abstract
Contents
Eddy Current Mitigation for On-Chip Inductors
Organization Name
Inventor(s)
Behzad Biglarbegian of San Jose CA (US)
Hongrui Wang of San Jose CA (US)
Abbas Komijani of Mountain View CA (US)
Reetika K Agarwal of Sunnyvale CA (US)
Eddy Current Mitigation for On-Chip Inductors - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240357733 titled 'Eddy Current Mitigation for On-Chip Inductors
Simplified Explanation: The patent application describes an electronic device with a transceiver that includes an inductor surrounded by a ring of ground traces. Circuit components are patterned onto the substrate around the inductor, creating trees of components with feed lines extending outward from a central axis.
Key Features and Innovation:
- Transceiver with inductor and ground traces on a substrate.
- Circuit components patterned around the inductor in trees with radial feed lines.
- Components used for bypass capacitors, low-dropout regulator load, loop filter of a phase-locked loop, and other transceiver functions.
- Components arranged to prevent eddy currents and meet fill factor requirements.
Potential Applications: The technology can be used in various electronic devices such as smartphones, IoT devices, and communication systems.
Problems Solved: The technology addresses the need for efficient signal transmission and power management in electronic devices.
Benefits:
- Improved signal transmission efficiency.
- Enhanced power management capabilities.
- Compact design for space-constrained devices.
Commercial Applications: Potential commercial applications include mobile phones, smart home devices, and wireless communication systems. The technology can improve the performance and efficiency of these products in the market.
Prior Art: Prior art related to this technology may include research on inductor design, circuit component layout, and signal transmission in electronic devices.
Frequently Updated Research: Researchers may be exploring advancements in inductor technology, circuit component integration, and signal processing algorithms for transceivers.
Questions about Electronic Device Transceiver Technology: 1. How does the arrangement of circuit components around the inductor improve signal transmission efficiency? 2. What are the key factors to consider when designing a transceiver with integrated circuit components?
Original Abstract Submitted
an electronic device may include a transceiver with a substrate and an inductor on the substrate. a ring of ground traces may surround the inductor. circuit components may be patterned onto the substrate overlapping the inductor, a region of the substrate surrounded by the inductor, and/or a region of the substrate between the inductor and the ring. the components may be arranged in trees with feed lines extending radially outward from a central axis. the components in each tree may be separated from the capacitors in other trees by gaps, preventing eddy currents on the trees. the components may be used to form bypass capacitors for power supply lines, a low-dropout regulator load, part of the loop filter of a phase-locked loop, or other portions of the transceiver. the components may thereby be used to convey signals while also meeting fill factor requirements associated with fabrication of the substrate.
