Apple inc. (20240321833). Fully Interconnected Heterogeneous Multi-layer Reconstructed Silicon Device simplified abstract
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Fully Interconnected Heterogeneous Multi-layer Reconstructed Silicon Device
Organization Name
Inventor(s)
Fully Interconnected Heterogeneous Multi-layer Reconstructed Silicon Device - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240321833 titled 'Fully Interconnected Heterogeneous Multi-layer Reconstructed Silicon Device
- Simplified Explanation:**
The patent application describes reconstructed 3DIC structures where dies in each package level can function as both functional chips and stitching devices for adjacent dies, acting as communication bridges between them.
- Key Features and Innovation:**
- Dies in each package level of a 3DIC can act as functional chips and stitching devices.
- Each die can serve as a communication bridge between two other dies/chiplets.
- Enables improved communication and connectivity between dies in a 3DIC structure.
- Potential Applications:**
This technology can be applied in:
- High-performance computing systems
- Data centers
- Networking equipment
- Artificial intelligence and machine learning applications
- Problems Solved:**
- Enhances communication and connectivity between dies in a 3DIC structure.
- Optimizes space utilization within the 3DIC package levels.
- Improves overall performance and efficiency of 3DIC systems.
- Benefits:**
- Enhanced communication and connectivity between dies.
- Increased efficiency and performance of 3DIC structures.
- Optimized space utilization within the package levels.
- Commercial Applications:**
Title: Enhanced Connectivity in 3DIC Structures for Improved Performance This technology can be commercially utilized in:
- Semiconductor industry
- Electronics manufacturing
- Telecommunications sector
- Aerospace and defense applications
- Questions about 3DIC Structures:**
1. How does this technology improve communication between dies in a 3DIC structure?
- This technology allows each die to act as a communication bridge between two other dies, enhancing connectivity within the structure.
2. What are the potential applications of reconstructed 3DIC structures in various industries?
- Reconstructed 3DIC structures can find applications in high-performance computing, data centers, networking, and AI/ML sectors.
Original Abstract Submitted
reconstructed 3dic structures and methods of manufacture are described. in an embodiment, one or more dies in each package level of a 3dic are both functional chips and/or stitching devices for two or more dies in an adjacent package level. thus, each die can function as a communication bridge between two other dies/chiplets in addition to performing a separate chip core function.
