Apple inc. (20240315054). Upside-Down DRAM Package Structure simplified abstract
Contents
Upside-Down DRAM Package Structure
Organization Name
Inventor(s)
Jiongxin Lu of Cupertino CA (US)
Kunzhong Hu of Cupertino CA (US)
Upside-Down DRAM Package Structure - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240315054 titled 'Upside-Down DRAM Package Structure
The abstract describes electronic package and package on package (PoP) structures, where the top electronic package in a PoP structure may include back-to-face stacked dies or face-to-back stacked dies. In one embodiment, the top electronic package is inverted, placing the stacked dies between the top package substrate and an underlying package in the PoP structure.
- Electronic package and package on package (PoP) structures are discussed in the patent application.
- The top electronic package in a PoP structure may contain back-to-face stacked dies or face-to-back stacked dies.
- In one scenario, the top electronic package is inverted, positioning the stacked dies between the top package substrate and an underlying package in the PoP structure.
Potential Applications: - This technology could be used in advanced electronic devices such as smartphones, tablets, and laptops. - It may find applications in the automotive industry for advanced driver assistance systems (ADAS) and infotainment systems.
Problems Solved: - Improved integration of electronic components in a compact space. - Enhanced performance and reliability of electronic devices.
Benefits: - Increased functionality in smaller form factors. - Enhanced thermal management for better performance. - Improved signal integrity and reduced electromagnetic interference.
Commercial Applications: Title: Advanced Electronic Packaging Solutions for Compact Devices This technology could revolutionize the consumer electronics industry by enabling smaller, more powerful devices with improved performance and reliability. It could also drive innovation in the automotive sector by enhancing the capabilities of ADAS and infotainment systems.
Questions about Electronic Packaging Solutions: 1. How does this technology impact the design of electronic devices? This technology allows for more compact and efficient designs, leading to smaller and more powerful electronic devices.
2. What are the potential cost implications of implementing this advanced packaging technology? While initial costs may be higher due to the complexity of the technology, the long-term benefits in terms of performance and reliability outweigh the initial investment.
Original Abstract Submitted
electronic package and package on package (pop) structures are described. the electronic package may be a top electronic package in a pop structure. in an embodiment, the top electronic package includes back-to-face stacked dies and the top electronic package is inverted such that the stacked dies are between the top package substrate and an underlying package in a pop structure. in an embodiment, the top electronic package includes face-to-back stacked dies such that the top die of the top electronic package is facing the underlying package in a pop structure.
