Apple inc. (20240249989). Selectively Dispensed Underfill and Edge Bond Patterns simplified abstract

Selectively Dispensed Underfill and Edge Bond Patterns

Organization Name

apple inc.

Inventor(s)

Wei Chen of San Jose CA (US)

Balaji Nandhivaram Muthuraman of Reutlingen (DE)

Arun Sasi of Kirchheim unter Teck (DE)

Jie-Hua Zhao of Cupertino CA (US)

Suk-Kyu Ryu of Cupertino CA (US)

Jun Zhai of Cupertino CA (US)

Dominic Morache of Santa Clara CA (US)

Young Doo Jeon of San Jose CA (US)

Selectively Dispensed Underfill and Edge Bond Patterns - A simplified explanation of the abstract

This abstract first appeared for US patent application 20240249989 titled 'Selectively Dispensed Underfill and Edge Bond Patterns

Simplified Explanation: The patent application describes microelectronic structures with selectively applied underfill material and/or edge bond material. In one embodiment, isolated underfill regions and/or edge bond regions are applied adjacent to one or more edges of an electronic device, forming a plurality of vent openings along the edges.

Key Features and Innovation:

• Microelectronic structures with selectively applied underfill material and/or edge bond material.
• Isolated underfill regions and/or edge bond regions applied adjacent to edges of electronic devices.
• Formation of vent openings along the edges for improved functionality.

Potential Applications: This technology can be applied in:

• Semiconductor packaging
• Electronic device manufacturing
• Microelectronics assembly

Problems Solved:

• Enhanced protection of electronic devices
• Improved thermal management
• Increased reliability of microelectronic structures

Benefits:

• Better performance of electronic devices
• Extended lifespan of microelectronic structures
• Enhanced durability in harsh environments

Commercial Applications: Potential commercial uses include:

• Consumer electronics
• Automotive electronics
• Aerospace applications

Prior Art: Readers can explore prior art related to microelectronic structures, underfill materials, and edge bond materials in the field of electronic device manufacturing.

Frequently Updated Research: Stay informed about the latest advancements in underfill materials, edge bond technologies, and microelectronic structure design for electronic devices.

Questions about Microelectronic Structures with Selectively Applied Underfill Material and/or Edge Bond Material: 1. What are the key benefits of using underfill material in microelectronic structures? 2. How does the application of edge bond material improve the reliability of electronic devices?

Original Abstract Submitted

microelectronic structures with selectively applied underfill material and/or edge bond material are described. in an embodiment, isolated underfill regions and/or edge bond regions are applied to adjacent to one or more edges of an electronic device and form a plurality of vent openings along the one or more edges.