Apple inc. (20240234399). Light Emitting Structure simplified abstract
Contents
Light Emitting Structure
Organization Name
Inventor(s)
John A. Higginson of Santa Clara CA (US)
Andreas Bibl of Los Altos CA (US)
Hsin-Hua Hu of Los Altos CA (US)
Light Emitting Structure - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240234399 titled 'Light Emitting Structure
Simplified Explanation: The patent application describes a method and structure for receiving a micro device on a receiving substrate, such as a micro LED device being punched through a passivation layer covering a conductive layer on the substrate.
Key Features and Innovation:
- Micro device, like a micro LED, punched through passivation layer on receiving substrate.
- Passivation layer is hardened after the micro device is punched through.
- Micro LED device can be punched through a B-staged thermoset material or a thermoplastic material.
Potential Applications: This technology can be used in the manufacturing of micro devices, particularly in the field of LED technology. It can also have applications in other microelectronics industries where precise placement of devices on substrates is crucial.
Problems Solved: This technology solves the problem of securely attaching micro devices to receiving substrates without damaging the devices or the substrate. It ensures precise placement and secure attachment of micro devices.
Benefits: The benefits of this technology include improved manufacturing processes for micro devices, increased efficiency in device placement, and enhanced durability of the devices on the substrates.
Commercial Applications: Title: Advanced Micro Device Placement Technology This technology can be commercially applied in the LED manufacturing industry, microelectronics industry, and any other industry that requires precise placement of micro devices on substrates. It can improve production processes and product quality.
Prior Art: Readers can explore prior art related to micro device placement technologies in the field of microelectronics manufacturing, particularly in the area of LED device manufacturing processes.
Frequently Updated Research: Researchers are constantly exploring new materials and methods for improving the placement and attachment of micro devices on substrates. Stay updated on the latest advancements in micro device manufacturing technologies.
Questions about Micro Device Placement Technology: 1. What are the potential challenges in implementing this technology in large-scale manufacturing processes? 2. How does this technology compare to existing methods of micro device placement in terms of efficiency and precision?
Original Abstract Submitted
a method and structure for receiving a micro device on a receiving substrate are disclosed. a micro device such as a micro led device is punched-through a passivation layer covering a conductive layer on the receiving substrate, and the passivation layer is hardened. in an embodiment the micro led device is punched-through a b-staged thermoset material. in an embodiment the micro led device is punched-through a thermoplastic material.
