Apple inc. (20240188243). COMPONENTS OF AN ELECTRONIC DEVICE AND METHODS FOR THEIR ASSEMBLY simplified abstract
Contents
- 1 COMPONENTS OF AN ELECTRONIC DEVICE AND METHODS FOR THEIR ASSEMBLY
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 COMPONENTS OF AN ELECTRONIC DEVICE AND METHODS FOR THEIR ASSEMBLY - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Original Abstract Submitted
COMPONENTS OF AN ELECTRONIC DEVICE AND METHODS FOR THEIR ASSEMBLY
Organization Name
Inventor(s)
Bryan P. Kiple of Los Gatos CA (US)
Charles B. Woodhull of San Francisco CA (US)
David A. Pakula of San Francisco CA (US)
Tang Y. Tan of San Francisco CA (US)
COMPONENTS OF AN ELECTRONIC DEVICE AND METHODS FOR THEIR ASSEMBLY - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240188243 titled 'COMPONENTS OF AN ELECTRONIC DEVICE AND METHODS FOR THEIR ASSEMBLY
Simplified Explanation
The abstract of the patent application describes a method for assembling electronic device housings by connecting different sections together using coupling members formed through a two-shot molding process.
- The housing of an electronic device is formed by assembling and connecting two or more different sections together.
- The sections of the housing are coupled together using one or more coupling members.
- The coupling members are formed using a two-shot molding process, where the first shot forms a structural portion and the second shot forms cosmetic portions of the coupling members.
Potential Applications
The technology described in this patent application could be applied in the manufacturing of various electronic devices such as smartphones, tablets, laptops, and other consumer electronics.
Problems Solved
This technology solves the problem of efficiently assembling electronic device housings by providing a method for connecting different sections together using coupling members formed through a two-shot molding process.
Benefits
The benefits of this technology include improved structural integrity of electronic device housings, simplified assembly processes, and enhanced aesthetics due to the use of cosmetic portions in the coupling members.
Potential Commercial Applications
The potential commercial applications of this technology include the manufacturing of electronic devices by companies in the consumer electronics industry.
Possible Prior Art
One possible prior art for this technology could be the use of traditional molding processes for forming coupling members in electronic device housings.
Unanswered Questions
How does the two-shot molding process compare to other methods of forming coupling members in electronic device housings?
The two-shot molding process offers advantages such as improved efficiency and enhanced aesthetics compared to traditional molding processes.
What are the specific materials used in the two-shot molding process for forming the coupling members?
The specific materials used in the two-shot molding process may vary depending on the requirements of the electronic device housing, but typically include structural and cosmetic materials.
Original Abstract Submitted
various components of an electronic device housing and methods for their assembly are disclosed. the housing can be formed by assembling and connecting two or more different sections together. the sections of the housing may be coupled together using one or more coupling members. the coupling members may be formed using a two-shot molding process in which the first shot forms a structural portion of the coupling members, and the second shot forms cosmetic portions of the coupling members.
- Apple inc.
- Bryan P. Kiple of Los Gatos CA (US)
- Charles B. Woodhull of San Francisco CA (US)
- David A. Pakula of San Francisco CA (US)
- Tang Y. Tan of San Francisco CA (US)
- H05K5/04
- B23C5/00
- B23C5/10
- B23P11/00
- B23P17/00
- B23P17/02
- C25D11/02
- C25D11/12
- C25D11/24
- C25D11/34
- G03F1/38
- H01Q1/24
- H01Q1/42
- H04M1/02
- H04M1/11
- H05K5/02
- H05K5/03
- H05K13/00