Apple inc. (20240184355). Latency Events in Multi-Die Architecture simplified abstract

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Latency Events in Multi-Die Architecture

Organization Name

apple inc.

Inventor(s)

Inder M. Sodhi of Palo Alto CA (US)

Achmed R. Zahir of Menlo Park CA (US)

Lior Zimet of Kerem Maharal (IL)

Liran Fishel of Raanana (IL)

Omri Flint of Ramat Hasharon (IL)

Ami Schwartzman of Kfar-Sava (IL)

Latency Events in Multi-Die Architecture - A simplified explanation of the abstract

This abstract first appeared for US patent application 20240184355 titled 'Latency Events in Multi-Die Architecture

Simplified Explanation

The patent application describes techniques for synchronizing power states between integrated circuit dies within a system. Here are some key points from the abstract:

  • System includes an integrated circuit with multiple dies connected together.
  • Primary power manager circuit in one die can request other dies to transition power states.
  • Secondary power manager circuits in other dies receive the request, transition to the new power state, and acknowledge the transition.
  • Techniques for managing latency tolerance events within a multi-die integrated circuit are also disclosed.

Potential Applications

This technology could be applied in:

  • Multi-core processors
  • System-on-chip (SoC) designs
  • High-performance computing systems

Problems Solved

  • Efficient power management in multi-die integrated circuits
  • Synchronization of power states across different dies
  • Managing latency tolerance events effectively

Benefits

  • Improved power efficiency
  • Enhanced system performance
  • Better coordination between integrated circuit dies

Potential Commercial Applications

  • Data centers
  • Mobile devices
  • Automotive electronics

Possible Prior Art

One possible prior art could be techniques for power management in multi-core processors or SoC designs.

Unanswered Questions

How does this technology impact overall system reliability?

This article does not address the impact of synchronizing power states on the reliability of the integrated circuit system.

What are the potential challenges in implementing these techniques in real-world applications?

The article does not discuss the challenges that may arise when implementing these power state synchronization techniques in practical systems.


Original Abstract Submitted

techniques are disclosed that pertain to synchronizing power states between integrated circuit dies. a system includes an integrated circuit that includes a plurality of integrated circuit dies coupled together. a particular integrated circuit die may include a primary power manager circuit and one or more remaining integrated circuit dies include respective secondary power manager circuits. the primary power manager circuit is configured to issue a transition request to the secondary power manager circuits to transition their integrated circuit dies from a first power state to a second power state. a given secondary power manager circuit is configured to receive the transition request, transition its integrated circuit die to the second power state, and issue an acknowledgement to the primary power manager circuit that its integrated circuit die has been transitioned to the second power state. techniques are further disclosed relating to managing latency tolerance events within a multi-die integrated circuit.