Apple inc. (20240107734). ELECTRONICS MOUNTING SYSTEM simplified abstract
Contents
- 1 ELECTRONICS MOUNTING SYSTEM
ELECTRONICS MOUNTING SYSTEM
Organization Name
Inventor(s)
Lee B. Hamstra of Palo Alto CA (US)
Stephanie Y. Su of Burlingame CA (US)
Richard Li of San Francisco CA (US)
Thomas O. Henry of Palos Verdes Estates CA (US)
ELECTRONICS MOUNTING SYSTEM - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240107734 titled 'ELECTRONICS MOUNTING SYSTEM
Simplified Explanation
The abstract describes an electronic device with a camera assembly that is biased away from the housing's sidewall by a spring finger and a compression block.
- The electronic device includes a housing with an internal volume.
- A display is secured to the housing.
- A camera assembly is located between the display and the sidewall.
- A spring finger biases the camera assembly away from the sidewall.
- A compression block is positioned between the camera assembly and the sidewall.
Potential Applications
This technology could be used in smartphones, tablets, laptops, or any electronic device with a camera to improve the stability and functionality of the camera assembly.
Problems Solved
This innovation solves the problem of camera misalignment or damage due to external forces or shocks by providing a mechanism to keep the camera assembly securely positioned within the device.
Benefits
The benefits of this technology include improved camera performance, increased durability of the camera assembly, and enhanced user experience with the electronic device.
Potential Commercial Applications
The potential commercial applications of this technology could be in the consumer electronics industry, specifically in the manufacturing of smartphones, tablets, laptops, and other devices with integrated cameras.
Possible Prior Art
One possible prior art could be the use of shock-absorbing materials or structures within electronic devices to protect sensitive components from external forces or impacts.
Unanswered Questions
How does this technology impact the overall size and weight of the electronic device?
This article does not address how the addition of the spring finger and compression block affects the dimensions and weight of the electronic device.
Are there any potential drawbacks or limitations to this technology?
The article does not mention any drawbacks or limitations that may be associated with the implementation of this technology.
Original Abstract Submitted
an electronic device includes a housing having a sidewall defining an internal volume, a display secured to the housing, a camera assembly disposed in the internal volume between the display and the sidewall, a spring finger biasing the camera assembly away from the sidewall, and a compression block disposed between the camera assembly and the sidewall.