Apple inc. (20240097340). Electronic Devices with Wireless Board-to-Board Connectors simplified abstract

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Electronic Devices with Wireless Board-to-Board Connectors

Organization Name

apple inc.

Inventor(s)

Thuy Nguyen of San Jose CA (US)

Behzad Biglarbegian of San Jose CA (US)

Electronic Devices with Wireless Board-to-Board Connectors - A simplified explanation of the abstract

This abstract first appeared for US patent application 20240097340 titled 'Electronic Devices with Wireless Board-to-Board Connectors

Simplified Explanation

The abstract describes an electronic device with baseband circuitry connected to antennas through signal paths on multiple substrates, with a wireless connector including transceivers and antennas on different substrates, and dielectric layers for smooth impedance transition between antennas.

  • The electronic device includes baseband circuitry connected to antennas on different substrates.
  • A wireless connector with transceivers and antennas on separate substrates allows for signal transmission between the antennas.
  • Dielectric layers between the antennas create a smooth impedance transition for efficient wireless signal transmission.

Potential Applications

The technology described in this patent application could be applied in various electronic devices such as smartphones, tablets, laptops, and IoT devices.

Problems Solved

This technology solves the problem of efficiently transmitting wireless signals between antennas on different substrates within an electronic device.

Benefits

The benefits of this technology include improved signal transmission efficiency, reduced signal interference, and enhanced overall performance of electronic devices.

Potential Commercial Applications

The potential commercial applications of this technology include telecommunications equipment, consumer electronics, and IoT devices.

Possible Prior Art

One possible prior art for this technology could be the use of wireless connectors with dielectric layers in electronic devices to improve signal transmission efficiency.

Unanswered Questions

How does this technology impact the overall size of electronic devices?

This technology could potentially allow for more compact electronic devices by optimizing the placement of antennas and signal paths.

What are the potential limitations of using dielectric layers in wireless connectors?

One potential limitation could be the added complexity and cost of manufacturing electronic devices with dielectric layers in wireless connectors.


Original Abstract Submitted

an electronic device may include baseband circuitry coupled to antennas over a communication path that includes signal paths on a first substrate, a second substrate, and a third substrate. the antennas may be disposed on the third substrate. a wireless connector may couple the paths on the third substrate to the paths on the second substrate. the wireless connector may include a first transceiver and first antenna on the third substrate and a second transceiver and second antenna on the second substrate. the wireless connector may include one or more dielectric layers disposed between the first antenna and the second antenna. the layers may form a smooth impedance transition between the first antenna and the second antenna. the layers may include one or two angled layers that redirect wireless signals between the first and second antennas to allow the first and second substrates to be offset within the device.