Advanced micro devices, inc. (20240111344). CONTROL SCHEME FOR REGULATING THERMOELECTRIC COOLING DEVICE POWER FOR A COMPUTING DEVICE simplified abstract

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CONTROL SCHEME FOR REGULATING THERMOELECTRIC COOLING DEVICE POWER FOR A COMPUTING DEVICE

Organization Name

advanced micro devices, inc.

Inventor(s)

MICHAEL J. Austin of AUSTIN TX (US)

CHRISTOPHER M. Helberg of AUSTIN TX (US)

SUKESH Shenoy of AUSTIN TX (US)

CHRISTOPHER M. Jaggers of AUSTIN TX (US)

CONTROL SCHEME FOR REGULATING THERMOELECTRIC COOLING DEVICE POWER FOR A COMPUTING DEVICE - A simplified explanation of the abstract

This abstract first appeared for US patent application 20240111344 titled 'CONTROL SCHEME FOR REGULATING THERMOELECTRIC COOLING DEVICE POWER FOR A COMPUTING DEVICE

Simplified Explanation

The apparatus described in the patent application is a cooling system for components, specifically a thermoelectric cooling (TEC) device coupled to a processor and controlled by a controller based on the activity level of the processor.

  • The apparatus includes a thermoelectric cooling (TEC) device connected to a processor.
  • A controller receives data on the activity level of the processor and adjusts the power provided to the TEC device accordingly.
  • The controller determines the TEC power level based on the processor's activity level to optimize cooling efficiency.

Potential Applications

The technology can be applied in:

  • High-performance computing systems
  • Data centers
  • Industrial machinery

Problems Solved

  • Overheating of processors
  • Inefficient cooling systems
  • Energy consumption in cooling processes

Benefits

  • Improved performance and longevity of processors
  • Energy efficiency
  • Customizable cooling solutions

Potential Commercial Applications

  • Computer hardware manufacturers
  • Cooling system providers
  • Data center operators

Possible Prior Art

One possible prior art could be traditional cooling systems that do not dynamically adjust cooling power based on the activity level of the processor.

Unanswered Questions

How does the controller determine the appropriate TEC power level based on the processor's activity level?

The patent abstract does not provide specific details on the algorithm or method used by the controller to determine the TEC power level.

Are there any limitations to the scalability of this cooling system for larger processors or systems?

The patent abstract does not address potential limitations or scalability issues that may arise when applying this technology to larger processors or systems.


Original Abstract Submitted

an apparatus for component cooling includes a thermoelectric cooling (tec) device configured to be thermally coupled to a first processor, and a controller. the controller is configured to receive at least one first parameter indicative of a first activity level of the first processor; determine a tec power level from among a plurality of tec power levels based on the at least one first parameter; and control providing of power to the tec device at the determined tec power level.

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