Advanced micro devices, inc. (20240111269). COMPONENT COOLER WITH MULTIPLE FLUID PATHS simplified abstract

COMPONENT COOLER WITH MULTIPLE FLUID PATHS

Organization Name

advanced micro devices, inc.

Inventor(s)

CHRISTOPHER M. Jaggers of AUSTIN TX (US)

ROBERT EDWARD Radke of AUSTIN TX (US)

CHRISTOPHER M. Helberg of AUSTIN TX (US)

COMPONENT COOLER WITH MULTIPLE FLUID PATHS - A simplified explanation of the abstract

This abstract first appeared for US patent application 20240111269 titled 'COMPONENT COOLER WITH MULTIPLE FLUID PATHS

Simplified Explanation

The patent application describes an apparatus for component cooling that utilizes two heat transfer elements and a manifold to split a single fluid flow into two separate flows for cooling.

• The apparatus includes a first heat transfer element and a second heat transfer element, both thermally coupled to a heat-generating component.
• A manifold is used to receive a single fluid flow of a heat transfer medium and split it into two separate flows, one for each heat transfer element.

Potential Applications

This technology could be applied in various electronic devices, such as computers, servers, and mobile phones, to improve cooling efficiency and prolong the lifespan of components.

Problems Solved

This technology helps to address the issue of overheating in electronic devices, which can lead to performance degradation and component failure. By efficiently cooling heat-generating components, this apparatus can help maintain optimal operating conditions.

Benefits

The benefits of this technology include improved cooling performance, increased component lifespan, and enhanced overall device reliability. By effectively managing heat dissipation, this apparatus can contribute to better device performance and user experience.

Potential Commercial Applications

This cooling apparatus could be integrated into electronic devices across various industries, including consumer electronics, data centers, and telecommunications. Manufacturers could use this technology to enhance the thermal management of their products and differentiate themselves in the market.

Possible Prior Art

One possible prior art for this technology could be traditional cooling systems used in electronic devices, such as fans and heat sinks. However, the specific design of splitting a single fluid flow into two separate flows for cooling may be a novel aspect of this patent application.

How does this technology compare to existing cooling solutions on the market?

This article does not provide a direct comparison between this technology and other cooling solutions currently available. Further research or testing would be needed to evaluate the performance and efficiency of this apparatus in comparison to existing options.

What are the potential limitations or drawbacks of implementing this cooling apparatus in electronic devices?

The article does not address any potential limitations or drawbacks of using this cooling apparatus. It would be important to consider factors such as cost, complexity of implementation, and compatibility with different device designs when assessing the feasibility of integrating this technology.

Original Abstract Submitted

an apparatus for component cooling includes a first heat transfer element configured to be thermally coupled to a heat-generating component and a second heat transfer element configured to be thermally coupled to the heat-generating component. a manifold is configured to receive a single fluid flow of a heat transfer medium and split the single fluid flow into a first split fluid flow provided to the first heat transfer element and a second split fluid flow provided to the second heat transfer element.