6G Technology patent applications on January 2nd, 2025
Patent Applications for 6G Technology on January 2nd, 2025
Number of patent applications containing '6G Technology' or its variations: 8
Organization: Intel Corporation
Inventor(s): Georgios PANAGOPOULOS of Munich DE for Intel Corporation, Steven CALLENDER of Denver CO US for Intel Corporation, Richard GEIGER of Munich DE for Intel Corporation, Georgios C. DOGIAMIS of Chandler AZ US for Intel Corporation, Manisha DUTTA of Munich DE for Intel Corporation, Stefano PELLERANO of Beaverton OR US for Intel Corporation
IPC Code(s): H01L23/66, H01L29/16, H01L29/20, H03F3/195, H03F3/213
CPC Code(s): H01L23/66
Organization: SAMSUNG ELECTRONICS CO., LTD.
Inventor(s): Donggu KIM of Suwon-si KR for SAMSUNG ELECTRONICS CO., LTD., Woojae JEONG of Suwon-si KR for SAMSUNG ELECTRONICS CO., LTD., Seunghyun LEE of Suwon-si KR for SAMSUNG ELECTRONICS CO., LTD., Juho LEE of Suwon-si KR for SAMSUNG ELECTRONICS CO., LTD., Jungsoo JUNG of Suwon-si KR for SAMSUNG ELECTRONICS CO., LTD., Hanjin KIM of Suwon-si KR for SAMSUNG ELECTRONICS CO., LTD.
IPC Code(s): H04B7/04, H04W56/00
CPC Code(s): H04B7/04013
QUALCOMM Incorporated (20250007566). BEAM ACQUISITION FOR A RECONFIGURABLE INTELLIGENT SURFACE
Organization: QUALCOMM Incorporated
Inventor(s): Saeid Sahraei of San Diego CA US for QUALCOMM Incorporated, Krishna Kiran Mukkavilli of San Diego CA US for QUALCOMM Incorporated, Yu Zhang of San Diego CA US for QUALCOMM Incorporated, Hung Dinh Ly of San Diego CA US for QUALCOMM Incorporated
IPC Code(s): H04B7/04, H04B7/06
CPC Code(s): H04B7/04013
Organization: Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V.
Inventor(s): Thomas HAUSTEIN of Berlin DE for Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V., Paul Simon Holt LEATHER of Berlin DE for Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V., Lars THIELE of Berlin DE for Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V., Jasmina MCMENAMY of Berlin DE for Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V.
IPC Code(s): H04B7/04, H02J50/00
CPC Code(s): H04B7/04013
Organization: BEIJING XIAOMI MOBILE SOFTWARE CO., LTD.
Inventor(s): Liangang CHI of Beijing CN for BEIJING XIAOMI MOBILE SOFTWARE CO., LTD., Li YANG of Beijing CN for BEIJING XIAOMI MOBILE SOFTWARE CO., LTD.
IPC Code(s): H04B7/04, H04B7/0456
CPC Code(s): H04B7/04026
Organization: BEIJING JIAOTONG UNIVERSITY
Inventor(s): Jiakang ZHENG of Beijing CN for BEIJING JIAOTONG UNIVERSITY, Jiayi ZHANG of Beijing CN for BEIJING JIAOTONG UNIVERSITY, Bo AI of Beijing CN for BEIJING JIAOTONG UNIVERSITY
IPC Code(s): H04B7/0456, H04B7/06
CPC Code(s): H04B7/0478
QUALCOMM Incorporated (20250007590). TECHNIQUES FOR PERFORMING BEAMFORMING BASED ON ZONES
Organization: QUALCOMM Incorporated
Inventor(s): Ahmed ELSHAFIE of San Diego CA US for QUALCOMM Incorporated, Hung Dinh LY of San Diego CA US for QUALCOMM Incorporated, Yu ZHANG of San Diego CA US for QUALCOMM Incorporated
IPC Code(s): H04B7/06, H04B7/08
CPC Code(s): H04B7/06952
Organization: BEIJING XIAOMI MOBILE SOFTWARE CO., LTD.
Inventor(s): Liangang CHI of Beijing CN for BEIJING XIAOMI MOBILE SOFTWARE CO., LTD., Gaoming DUAN of Beijing CN for BEIJING XIAOMI MOBILE SOFTWARE CO., LTD., Feng ZHENG of Beijing CN for BEIJING XIAOMI MOBILE SOFTWARE CO., LTD.
IPC Code(s): H04L27/00, H04L27/26
CPC Code(s): H04L27/0012
- H01L23/66
- H01L29/16
- H01L29/20
- H03F3/195
- H03F3/213
- CPC H03F3/213
- Intel Corporation
- H04B7/04
- H04W56/00
- CPC H04W56/00
- SAMSUNG ELECTRONICS CO., LTD.
- H04B7/06
- CPC H04B7/06
- QUALCOMM Incorporated
- H02J50/00
- CPC H02J50/00
- Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V.
- H04B7/0456
- CPC H04B7/0456
- BEIJING XIAOMI MOBILE SOFTWARE CO., LTD.
- BEIJING JIAOTONG UNIVERSITY
- H04B7/08
- CPC H04B7/08
- H04L27/00
- H04L27/26
- CPC H04L27/26
- 6G Technology
