5G Technologies patent applications on March 7th, 2024
Patent Applications for 5G Technologies on March 7th, 2024
Number of patent applications containing '5G Technologies' or its variations: 11
Organization: Unknown Organization
Inventor(s): Coleman DELUDE of Atlanta GA (US) for Unknown Organization, Justin ROMBERG of Atlanta GA (US) for Unknown Organization, Mark DAVENPORT of Atlanta GA (US) for Unknown Organization, Santhosh KARNIK of Atlanta GA (US) for Unknown Organization, Rakshith Sharma SRINIVASA of Atlanta GA (US) for Unknown Organization
IPC Code(s): G01S13/42, G01S7/28, G01S15/89
Organization: Micron Technology, Inc.
Inventor(s): Fa-Long Luo of Boise ID (US) for Micron Technology, Inc.
IPC Code(s): G06F17/16, G06F9/30, G06F12/02, G11C13/00
20240078656. MULTIMODAL SAFETY SYSTEMS AND METHODS simplified abstract (Everguard, Inc.)
Organization: Everguard, Inc.
Inventor(s): Sandeep Pandya of Irvine CA (US) for Everguard, Inc., Sundeep Ahluwalia of San Diego CA (US) for Everguard, Inc., Changsoo Jeong of Ranchos Palos Verdes CA (US) for Everguard, Inc., Michael Korkin of Irvine CA (US) for Everguard, Inc., Kyungsuk Lee of Ranchos Palos Verdes CA (US) for Everguard, Inc., Christopher Ro of Aliso Viejo CA (US) for Everguard, Inc., Yong Wu of Signal Hill CA (US) for Everguard, Inc.
IPC Code(s): G06T7/00, G01P13/00, G01S17/42, G01S17/894, G06V20/52, G08B21/02
Organization: Telefonaktiebolaget LM Ericsson (publ)
Inventor(s): Yi Geng of Nanjing (CN) for Telefonaktiebolaget LM Ericsson (publ), Pål Frenger of Linköping (SE) for Telefonaktiebolaget LM Ericsson (publ)
IPC Code(s): H01Q3/24, H01Q1/24, H01Q15/08, H01Q19/06
Organization: SAMSUNG ELECTRONICS CO., LTD.
Inventor(s): Sangho LEE of Suwon-si (KR) for SAMSUNG ELECTRONICS CO., LTD., Byounghoon JUNG of Suwon-si (KR) for SAMSUNG ELECTRONICS CO., LTD., Jungsoo JUNG of Suwon-si (KR) for SAMSUNG ELECTRONICS CO., LTD., Jiyoung CHA of Suwon-si (KR) for SAMSUNG ELECTRONICS CO., LTD., Jinho CHOI of Suwon-si (KR) for SAMSUNG ELECTRONICS CO., LTD.
IPC Code(s): H04B7/06, H04B7/08
Organization: Senscomm Semiconductor Co., Ltd.
Inventor(s): Sung Jin PARK of Seoul (KR) for Senscomm Semiconductor Co., Ltd., Daehong KIM of Laguna Hills CA (US) for Senscomm Semiconductor Co., Ltd.
IPC Code(s): H04B7/06, H04W16/28
Organization: Apple Inc.
Inventor(s): Wanlu Sun of San Diego CA (US) for Apple Inc., Sharad Sambhwani of San Diego CA (US) for Apple Inc., Sung-En Chiu of San Diego CA (US) for Apple Inc.
IPC Code(s): H04B7/06, H04B7/0456
Organization: Telefonaktiebolaget LM Ericsson (publ)
Inventor(s): Sven PETERSSON of Sävedalen (SE) for Telefonaktiebolaget LM Ericsson (publ), Fredrik ATHLEY of Kullavik (SE) for Telefonaktiebolaget LM Ericsson (publ), Andreas NILSSON of Göteborg (SE) for Telefonaktiebolaget LM Ericsson (publ)
IPC Code(s): H04B7/10, H01P1/10, H01Q3/26, H01Q21/08, H03F3/60, H03F3/72, H04B7/0426, H04B7/06
Organization: DALIAN UNIVERSITY OF TECHNOLOGY
Inventor(s): Zichuan Xu of Dalian City (CN) for DALIAN UNIVERSITY OF TECHNOLOGY, Qiufen Xia of Dalian City (CN) for DALIAN UNIVERSITY OF TECHNOLOGY, Haiyang Qiao of Dalian City (CN) for DALIAN UNIVERSITY OF TECHNOLOGY
IPC Code(s): H04B7/185, H04L47/62, H04W28/02
Organization: Amazon Technologies, Inc.
Inventor(s): Diwakar Gupta of Seattle WA (US) for Amazon Technologies, Inc., Kiran Kumar Edara of Cupertino CA (US) for Amazon Technologies, Inc., Igor A. Kostic of Redmond WA (US) for Amazon Technologies, Inc., Kaixiang Hu of Fremont CA (US) for Amazon Technologies, Inc., Shane Ashley Hall of Kirkland WA (US) for Amazon Technologies, Inc., Ishwardutt Parulkar of San Francisco CA (US) for Amazon Technologies, Inc.
IPC Code(s): H04W48/18, H04W4/50, H04W4/60, H04W28/02, H04W28/08, H04W28/16
Organization: QUALCOMM Incorporated
Inventor(s): Vasanthan RAGHAVAN of West Windsor Township NJ (US) for QUALCOMM Incorporated, Mohammad Ali TASSOUDJI of San Diego CA (US) for QUALCOMM Incorporated, Junyi LI of Fairless Hills PA (US) for QUALCOMM Incorporated, Tao LUO of San Diego CA (US) for QUALCOMM Incorporated, Ruhua HE of San Diego CA (US) for QUALCOMM Incorporated, Raghu Narayan CHALLA of San Diego CA (US) for QUALCOMM Incorporated
IPC Code(s): H04W52/42, H04W52/06, H04W52/36
- G01S13/42
- G01S7/28
- G01S15/89
- Unknown Organization
- G06F17/16
- G06F9/30
- G06F12/02
- G11C13/00
- Micron Technology, Inc.
- G06T7/00
- G01P13/00
- G01S17/42
- G01S17/894
- G06V20/52
- G08B21/02
- Everguard, Inc.
- H01Q3/24
- H01Q1/24
- H01Q15/08
- H01Q19/06
- Telefonaktiebolaget LM Ericsson (publ)
- H04B7/06
- H04B7/08
- SAMSUNG ELECTRONICS CO., LTD.
- H04W16/28
- Senscomm Semiconductor Co., Ltd.
- H04B7/0456
- Apple Inc.
- H04B7/10
- H01P1/10
- H01Q3/26
- H01Q21/08
- H03F3/60
- H03F3/72
- H04B7/0426
- H04B7/185
- H04L47/62
- H04W28/02
- DALIAN UNIVERSITY OF TECHNOLOGY
- H04W48/18
- H04W4/50
- H04W4/60
- H04W28/08
- H04W28/16
- Amazon Technologies, Inc.
- H04W52/42
- H04W52/06
- H04W52/36
- QUALCOMM Incorporated
- 5G Technologies