5G Technologies patent applications on February 15th, 2024
Patent Applications for 5G Technologies on February 15th, 2024
Number of patent applications containing '5G Technologies' or its variations: 20
Organization: Zadar Labs, Inc
Inventor(s): Mohammad EMADI of San Jose CA (US) for Zadar Labs, Inc, Ali MOSTAJERAN of Morgan Hill CA (US) for Zadar Labs, Inc, Mahmoud SAADAT of Redwood City CA (US) for Zadar Labs, Inc
IPC Code(s): G01S7/40, G01S7/292, G01S13/42
Organization: NANJING DESAY SV AUTOMOTIVE CO., LTD.
Inventor(s): Qiongfeng ZHOU of Jiangning District, Nanjing, Jiangsu (CN) for NANJING DESAY SV AUTOMOTIVE CO., LTD., Jiahuan LIU of Jiangning District, Nanjing, Jiangsu (CN) for NANJING DESAY SV AUTOMOTIVE CO., LTD.
IPC Code(s): G01S13/931, G01S7/41
Organization: Intel Corporation
Inventor(s): Vidya Ranganathan of Bangalore (IN) for Intel Corporation, Aditya Shukla of Bangalore (IN) for Intel Corporation, Nitesh Kumar of Bangalore (IN) for Intel Corporation, Jitendra Kumar Saini of Alwar (IN) for Intel Corporation
IPC Code(s): G06F8/61, G06F9/445, G06F21/57
Organization: Sony Group Corporation
Inventor(s): Kazuhiko TAKABAYASHI of Tokyo (JP) for Sony Group Corporation, Yasuaki YAMAGISHI of Tokyo (JP) for Sony Group Corporation
IPC Code(s): G06F9/48
Organization: Intel Corporation
Inventor(s): Nikita Zeulin of Tampere (FI) for Intel Corporation, Olga Galinina of Tampere (FI) for Intel Corporation, Sergey Andreev of Tampere (FI) for Intel Corporation, Nageen Himayat of Fremont CA (US) for Intel Corporation
IPC Code(s): G06N20/00
Organization: GM GLOBAL TECHNOLOGY OPERATIONS LLC
Inventor(s): Yuan Zhang of Shanghai (CN) for GM GLOBAL TECHNOLOGY OPERATIONS LLC
IPC Code(s): G08G1/01, H04W4/44
Organization: SJ Semiconductor (Jiangyin) Corporation
Inventor(s): Yenheng Chen of Jiangyin (CN) for SJ Semiconductor (Jiangyin) Corporation, Chengchung Lin of Jiangyin (CN) for SJ Semiconductor (Jiangyin) Corporation
IPC Code(s): H01L25/16, H01L23/538, H01L23/00, H01L23/498, H01L21/48
Organization: RFCORE CO.,LTD.
Inventor(s): Yong-Jun KIM of Chungcheongnam-do (KR) for RFCORE CO.,LTD.
IPC Code(s): H01Q3/34, H01Q3/26
Organization: QUALCOMM Incorporated
Inventor(s): Yehonatan Dallal of Kfar Saba (IL) for QUALCOMM Incorporated, Idan Michael Horn of Hod Hasharon (IL) for QUALCOMM Incorporated, Shay LANDIS of Hod Hasharon (IL) for QUALCOMM Incorporated
IPC Code(s): H01Q15/02, H01Q1/24, H01Q21/28
Organization: SHENZHEN SUNWAY COMMUNICATION CO., LTD.
Inventor(s): Ziming HE of San Diego CA (US) for SHENZHEN SUNWAY COMMUNICATION CO., LTD., Hongwei LIU of San Diego CA (US) for SHENZHEN SUNWAY COMMUNICATION CO., LTD., Neo SU of Shenzhen (CN) for SHENZHEN SUNWAY COMMUNICATION CO., LTD., Xiaoting YUAN of Shenzhen (CN) for SHENZHEN SUNWAY COMMUNICATION CO., LTD.
IPC Code(s): H01Q21/26, H01Q5/25, H01Q1/48, H01Q21/00
Organization: SoftBank Corp.
Inventor(s): Koji Tashiro of Tokyo (JP) for SoftBank Corp., Mitsukuni Konishi of Tokyo (JP) for SoftBank Corp., Kenji Hoshino of Tokyo (JP) for SoftBank Corp., Yoshichika Ota of Tokyo (JP) for SoftBank Corp., Atsushi Nagate of Tokyo (JP) for SoftBank Corp.
IPC Code(s): H04B7/0452, H04B7/185, H04W72/541
Organization: BRITISH TELECOMMUNICATIONS PUBLIC LIMITED COMPANY
Inventor(s): Jonathan HART of London (GB) for BRITISH TELECOMMUNICATIONS PUBLIC LIMITED COMPANY, Milan LALOVIC of London (GB) for BRITISH TELECOMMUNICATIONS PUBLIC LIMITED COMPANY
IPC Code(s): H04B7/06, H04W16/10
Organization: Intel Corporation
Inventor(s): Thushara HEWAVITHANA of Tempe AZ (US) for Intel Corporation, Ranjit CAVATUR of San Marcos CA (US) for Intel Corporation, Neelam CHANDWANI of Portland OR (US) for Intel Corporation, Ziyi LI of Beijing (CN) for Intel Corporation, Bishwarup MONDAL of San Ramon CA (US) for Intel Corporation
IPC Code(s): H04B7/06, H04B17/336
Organization: DISH Wireless L.L.C.
Inventor(s): David Zufall of Lone Tree CO (US) for DISH Wireless L.L.C.
IPC Code(s): H04L5/00, H04W72/0446, H04W72/1268
Organization: NEC Corporation
Inventor(s): Wataru JUSO of Tokyo (JP) for NEC Corporation, Hajime ZEMBUTSU of Tokyo (JP) for NEC Corporation
IPC Code(s): H04L41/0654, H04L43/0817, H04L43/065
Organization: International Business Machines Corporation
Inventor(s): Rajesh Kumar Saxena of Thane East (IN) for International Business Machines Corporation, Harish Bharti of Pune (IN) for International Business Machines Corporation, Sandeep Sukhija of Rajasthan (IN) for International Business Machines Corporation, Deepak Bajaj of Jaipur (IN) for International Business Machines Corporation
IPC Code(s): H04L41/0895, H04L41/5019
Organization: Cisco Technology, Inc.
Inventor(s): Omkara Srinivas Rao Karnati of Singapore (SG) for Cisco Technology, Inc., Ravi Shekhar of Pune (IN) for Cisco Technology, Inc., Seung Cheol Park of Eunpyeong-Gu Seoul (KR) for Cisco Technology, Inc., Rajaneesh Shetty of Bangalore (IN) for Cisco Technology, Inc., Niranjan Mallapura Mallikarjunaiah of Bangalore (IN) for Cisco Technology, Inc.
IPC Code(s): H04W8/18, H04W76/10, H04W48/18
20240056900. MBS SESSION MAINTENANCE AFTER HANDOVER simplified abstract (MediaTek Inc.)
Organization: MediaTek Inc.
Inventor(s): Yu-Hsin Lin of Hsin-Chu (TW) for MediaTek Inc., Yuan-Chieh Lin of Hsin-Chu (TW) for MediaTek Inc., Chi-Hsien Chen of Hsin-Chu (TW) for MediaTek Inc.
IPC Code(s): H04W36/00, H04W76/30
Organization: Huawei Technologies Co., Ltd.
Inventor(s): Pei Zhou of Chengdu (CN) for Huawei Technologies Co., Ltd., Yan Long of Chengdu (CN) for Huawei Technologies Co., Ltd., Xiao Han of Shenzhen (CN) for Huawei Technologies Co., Ltd., Yingpei Lin of Munich (DE) for Huawei Technologies Co., Ltd.
IPC Code(s): H04W48/10, H04L5/00, H04B7/06, H04W16/28, H04W72/0446, H04W74/08
Organization: DISH Wireless L.L.C.
Inventor(s): David Zufall of Lone Tree CO (US) for DISH Wireless L.L.C.
IPC Code(s): H04W72/541, H04W72/1268
- G01S7/40
- G01S7/292
- G01S13/42
- Zadar Labs, Inc
- G01S13/931
- G01S7/41
- NANJING DESAY SV AUTOMOTIVE CO., LTD.
- G06F8/61
- G06F9/445
- G06F21/57
- Intel Corporation
- G06F9/48
- Sony Group Corporation
- G06N20/00
- G08G1/01
- H04W4/44
- GM GLOBAL TECHNOLOGY OPERATIONS LLC
- H01L25/16
- H01L23/538
- H01L23/00
- H01L23/498
- H01L21/48
- SJ Semiconductor (Jiangyin) Corporation
- H01Q3/34
- H01Q3/26
- RFCORE CO.,LTD.
- H01Q15/02
- H01Q1/24
- H01Q21/28
- QUALCOMM Incorporated
- H01Q21/26
- H01Q5/25
- H01Q1/48
- H01Q21/00
- SHENZHEN SUNWAY COMMUNICATION CO., LTD.
- H04B7/0452
- H04B7/185
- H04W72/541
- SoftBank Corp.
- H04B7/06
- H04W16/10
- BRITISH TELECOMMUNICATIONS PUBLIC LIMITED COMPANY
- H04B17/336
- H04L5/00
- H04W72/0446
- H04W72/1268
- DISH Wireless L.L.C.
- H04L41/0654
- H04L43/0817
- H04L43/065
- NEC Corporation
- H04L41/0895
- H04L41/5019
- International Business Machines Corporation
- H04W8/18
- H04W76/10
- H04W48/18
- Cisco Technology, Inc.
- H04W36/00
- H04W76/30
- MediaTek Inc.
- H04W48/10
- H04W16/28
- H04W74/08
- Huawei Technologies Co., Ltd.
- 5G Technologies