3D Printing patent applications on October 24th, 2024
Patent Applications for 3D Printing on October 24th, 2024
Number of patent applications containing '3D Printing' or its variations: 33
IX Innovation LLC (20240350201). 3D PRINTING OF STRUCTURES INSIDE A PATIENT simplified abstract
Organization: IX Innovation LLC
Inventor(s): Jeffrey Roh of Seattle WA (US) for IX Innovation LLC, Justin Esterberg of Mesa AZ (US) for IX Innovation LLC, John Cronin of Jericho VT (US) for IX Innovation LLC, Seth Cronin of Essex Junction VT (US) for IX Innovation LLC, Michael J. Baker of Georgia VT (US) for IX Innovation LLC
IPC Code(s): A61B34/10, A61F2/30
CPC Code(s): A61B34/10
Organization: TSINGHUA UNIVERSITY
Inventor(s): Zhuo XIONG of Beijing (CN) for TSINGHUA UNIVERSITY, Yongcong FANG of Beijing (CN) for TSINGHUA UNIVERSITY, Ting ZHANG of Beijing (CN) for TSINGHUA UNIVERSITY, Yihan GUO of Beijing (CN) for TSINGHUA UNIVERSITY, Yujiang GUO of Beijing (CN) for TSINGHUA UNIVERSITY
IPC Code(s): A61L27/38, A61F2/06, A61L27/22, A61L27/50, A61L27/52, B33Y10/00, B33Y40/20, B33Y70/00, B33Y80/00
CPC Code(s): A61L27/38
Applied Materials, Inc. (20240351055). ICP SOURCE GAS DELIVERY HUB AND NOZZLE simplified abstract
Organization: Applied Materials, Inc.
Inventor(s): Yogananda Sarode Vishwanath of Bangalore (IN) for Applied Materials, Inc., Andrew Nguyen of San Jose CA (US) for Applied Materials, Inc., Tom K. Cho of Los Altos Hills CA (US) for Applied Materials, Inc.
IPC Code(s): B05B7/26, B05B1/00, B05B1/14, B05B13/02, B33Y80/00
CPC Code(s): B05B7/26
Organization: Nexa3D Inc.
Inventor(s): Daniel CAREY of Austin TX (US) for Nexa3D Inc., Omar HEGAZY of Long Beach CA (US) for Nexa3D Inc., Charles Brandon SWEENEY of Pflugerville TX (US) for Nexa3D Inc., Chad EICHELE of Lake Forest CA (US) for Nexa3D Inc.
IPC Code(s): B21F1/02, B22F12/50
CPC Code(s): B21F1/02
Organization: Headmade Materials GmbH
Inventor(s): Christian STAUDIGEL of Unterpleichfeld (DE) for Headmade Materials GmbH, Christian FISCHER of Unterpleichfeld (DE) for Headmade Materials GmbH
IPC Code(s): B22F1/10, B22F3/16, B22F10/18, B22F10/28, B22F10/64, B33Y10/00, B33Y70/10
CPC Code(s): B22F1/10
Organization: ASTROBOTIC TECHNOLOGY, INC.
Inventor(s): Matthew Kuhns of Hawthorne CA (US) for ASTROBOTIC TECHNOLOGY, INC., Jacob S. Nuechterlein of Erie CO (US) for ASTROBOTIC TECHNOLOGY, INC., Jeremy Joseph Iten of Erie CO (US) for ASTROBOTIC TECHNOLOGY, INC., Adam Polizzi of Erie CO (US) for ASTROBOTIC TECHNOLOGY, INC.
IPC Code(s): B22F3/11, B22F7/00, B22F10/28, B22F10/32, B22F10/34, B22F10/366, B22F10/38, B22F10/80, B23K26/082, B33Y10/00, B33Y30/00, B33Y50/02, B33Y70/00, B33Y80/00
CPC Code(s): B22F3/11
Organization: Headmade Materials GmbH
Inventor(s): Christian STAUDIGEL of Unterpleichfeld (DE) for Headmade Materials GmbH, Christian FISCHER of Unterpleichfeld (DE) for Headmade Materials GmbH
IPC Code(s): B22F10/16, B33Y10/00, B33Y70/10, C08K3/00, C08L81/10, C08L91/06
CPC Code(s): B22F10/16
Organization: General Electric Company
Inventor(s): Elliot C. Dilger of Ferdinand IN (US) for General Electric Company, Jacob W. Brown of Columbus IN (US) for General Electric Company, Taren DeHart of Columbus IN (US) for General Electric Company
IPC Code(s): B22F10/40, B22F3/10, B28B1/00, B33Y10/00, B33Y40/20
CPC Code(s): B22F10/40
Organization: Siemens Energy Global GmbH & Co. KG
Inventor(s): Ole Geisen of Berlin (DE) for Siemens Energy Global GmbH & Co. KG, Hamid Jahangir of Aachen (DE) for Siemens Energy Global GmbH & Co. KG
IPC Code(s): B22F10/85, B22F12/90, B33Y50/02
CPC Code(s): B22F10/85
Organization: ADDITIVE MONITORING, INC. dba Phase3D
Inventor(s): Niall O'Dowd of Chicago IL (US) for ADDITIVE MONITORING, INC. dba Phase3D
IPC Code(s): B23K26/03, B23K26/342
CPC Code(s): B23K26/032
Organization: Virginia Commonwealth University
Inventor(s): Logan Schorr of Henrico VA (US) for Virginia Commonwealth University, Ravi Hadimani of Glen Allen MD (US) for Virginia Commonwealth University, Bradley Johnson of Richmond VA (US) for Virginia Commonwealth University
IPC Code(s): B25J15/08, B22F10/28, B22F12/88, B22F12/90, B33Y10/00, B33Y30/00, B33Y50/02, B33Y70/00
CPC Code(s): B25J15/08
Organization: Unknown Organization
Inventor(s): Henry Wai Chaing CHAN of Palo Alto CA (US) for Unknown Organization
IPC Code(s): B29C64/118, B29C64/209, B29C64/295, B29C64/30
CPC Code(s): B29C64/118
Organization: Guill Tool & Engineering Co., Inc.
Inventor(s): Richard Guillemette of West Warwick RI (US) for Guill Tool & Engineering Co., Inc., Robert Peters of West Warwick RI (US) for Guill Tool & Engineering Co., Inc.
IPC Code(s): B29C64/118, B29C64/106, B29C69/00, B29K101/12, B33Y10/00, B33Y70/00, C08J5/12
CPC Code(s): B29C64/118
Organization: Georgia Tech Research Corporation
Inventor(s): Sourabh Kumar Saha of Atlanta GA (US) for Georgia Tech Research Corporation, Harnjoo Kim of Atlanta GA (US) for Georgia Tech Research Corporation, Rushil Pingali of Atlanta GA (US) for Georgia Tech Research Corporation
IPC Code(s): B29C64/135, B29C64/273, B33Y10/00, B33Y30/00, B33Y70/00
CPC Code(s): B29C64/135
Organization: Sakuu Corporation
Inventor(s): Morteza VATANI of Los Gatos CA (US) for Sakuu Corporation, Philip Eugene ROGREN of Half Moon Bay CA (US) for Sakuu Corporation
IPC Code(s): B29C64/165, B29C64/223, B33Y10/00, B33Y30/00, B33Y40/10, B33Y40/20
CPC Code(s): B29C64/165
Organization: Hewlett-Packard Development Company, L.P.
Inventor(s): Jarrid A. Wittkopf of Palo Alto CA (US) for Hewlett-Packard Development Company, L.P., Kristopher J. Erickson of Palo Alto CA (US) for Hewlett-Packard Development Company, L.P., Lihua Zhao of Palo Alto CA (US) for Hewlett-Packard Development Company, L.P.
IPC Code(s): B29C64/165, B29C35/08, B29C70/88, B29K105/16, B29K505/00, B29L31/34, B33Y10/00, B33Y70/00, H01C17/065
CPC Code(s): B29C64/165
Unknown Organization (20240351275). 3D PRINTING RETRACTABLE SLIP FORM simplified abstract
Organization: Unknown Organization
Inventor(s): Walter Rebsch of Vancouver WA (US) for Unknown Organization
IPC Code(s): B29C64/194, B33Y40/20
CPC Code(s): B29C64/194
Organization: DYZE DESIGN
Inventor(s): Philippe CARRIER of Montreal (CA) for DYZE DESIGN, Maxence GELINAS-GUY of Boucherville (CA) for DYZE DESIGN, Thomas JASMIN of Montreal (CA) for DYZE DESIGN
IPC Code(s): B29C64/209, B33Y30/00
CPC Code(s): B29C64/209
CEM TECH LLC (20240351281). HEATED EXTRUDER FOR 3D CONCRETE PRINTER simplified abstract
Organization: CEM TECH LLC
Inventor(s): Pierre Viaud-Murat of Bloomfield Hills MI (US) for CEM TECH LLC, Frank Marquette of Troy AL (US) for CEM TECH LLC, Steve Santa Cruz of La Jolla CA (US) for CEM TECH LLC, Michael Taylor of Carlsbad CA (US) for CEM TECH LLC, Jason Martin of San Diego CA (US) for CEM TECH LLC
IPC Code(s): B29C64/209, B29C64/295, B29C64/314, B33Y30/00, B33Y70/00
CPC Code(s): B29C64/209
Organization: 3D Systems, Inc.
Inventor(s): Colin Leonard Blain of Hertfordshire (GB) for 3D Systems, Inc.
IPC Code(s): B29C64/241, B29C64/106, B29C64/171, B29C64/245, B29C64/264, B29C64/386, B29L31/00, B33Y10/00, B33Y30/00, B33Y50/00, B33Y80/00
CPC Code(s): B29C64/241
Organization: Sakuu Corporation
Inventor(s): Morteza VATANI of Los Gatos CA (US) for Sakuu Corporation, Timothy BYMAN of Saint Michael MN (US) for Sakuu Corporation, Justin CARROLL of Vadnais Height MN (US) for Sakuu Corporation
IPC Code(s): B29C64/35, B08B5/04, B22F12/67, B29C64/153, B29C64/209, B29C64/214, B33Y30/00, B33Y40/00
CPC Code(s): B29C64/35
Organization: Kemeera Inc., (dba Fathom)
Inventor(s): Carlo Quinonez of Oakland CA (US) for Kemeera Inc., (dba Fathom), Skyler Brungardt of Oakland CA (US) for Kemeera Inc., (dba Fathom)
IPC Code(s): B29C64/386, B33Y50/00, G06F3/12, G06Q10/0639, G06Q50/04, H04L67/01, H04L69/16
CPC Code(s): B29C64/386
Organization: International Business Machines Corporation
Inventor(s): Jeremy R. FOX of Georgetown TX (US) for International Business Machines Corporation, Jill S. DHILLON of Jupiter FL (US) for International Business Machines Corporation, Tushar AGRAWAL of West Fargo ND (US) for International Business Machines Corporation, Sarbajit K. RAKSHIT of Kolkata (IN) for International Business Machines Corporation
IPC Code(s): B29C64/393
CPC Code(s): B29C64/393
Organization: SHENZHEN ANYCUBIC TECHNOLOGY CO., LTD.
Inventor(s): Qiming LIAO of Shenzhen (CN) for SHENZHEN ANYCUBIC TECHNOLOGY CO., LTD.
IPC Code(s): B29C64/393, B29C64/321, B29C64/35, B33Y30/00, B33Y40/00, B33Y50/02
CPC Code(s): B29C64/393
Organization: Carnegie Mellon University
Inventor(s): Andrew Hudson of Pittsburgh PA (US) for Carnegie Mellon University, Thomas Hinton of Pittsburgh PA (US) for Carnegie Mellon University, Adam Feinberg of Pittsburgh PA (US) for Carnegie Mellon University, Andrew Lee of Pittsburgh PA (US) for Carnegie Mellon University
IPC Code(s): B29C64/40, A61L27/20, A61L27/22, A61L27/24, A61L27/52, A61L27/56, B29C64/106, B29C64/165, B33Y10/00, B33Y30/00, B33Y70/00
CPC Code(s): B29C64/40
Organization: BOND HIGH PERFORMANCE 3D TECHNOLOGY B.V.
Inventor(s): Kevin Hendrik Jozef VOSS of Enschede (NL) for BOND HIGH PERFORMANCE 3D TECHNOLOGY B.V.
IPC Code(s): B29C64/40, B29C64/106, B33Y10/00, B33Y30/00, B33Y80/00
CPC Code(s): B29C64/40
Organization: Essilor International
Inventor(s): Jérôme MOINE of CHARENTON LE PONT (FR) for Essilor International, Mathieu FEUILLADE of CHARENTON LE PONT (FR) for Essilor International, Xavier BULTEZ of CHARENTON LE PONT (FR) for Essilor International
IPC Code(s): B29C64/40, B29C64/124, B29L11/00, B33Y10/00, B33Y30/00
CPC Code(s): B29C64/40
ALIGN TECHNOLOGY, INC. (20240352174). CROSSLINKERS AND COMPOSITIONS simplified abstract
Organization: ALIGN TECHNOLOGY, INC.
Inventor(s): Umesh Upendra Choudhary of Scotts Valley CA (US) for ALIGN TECHNOLOGY, INC., Raymond Bao Thai of San Jose CA (US) for ALIGN TECHNOLOGY, INC.
IPC Code(s): C08F291/00, A61C7/08, B29C64/124, B29K96/02, B29L31/00, B33Y10/00, B33Y70/00, B33Y80/00, C08F2/50, C08J5/18, C08K5/23
CPC Code(s): C08F291/00
Stratasys Ltd. (20240352269). ADDITIVE MANUFACTURING OF DENTAL PROSTHESES simplified abstract
Organization: Stratasys Ltd.
Inventor(s): Yaniv HIRSCHSOHN of Rehovot (IL) for Stratasys Ltd., Inna VINTS of Rehovot (IL) for Stratasys Ltd., Dani PERI of Rehovot (IL) for Stratasys Ltd., Elena SHPAYZER of Gedera (IL) for Stratasys Ltd., Lior ZONDER of Tel-Aviv (IL) for Stratasys Ltd.
IPC Code(s): C09D11/322, A61C13/00, B29C64/112, B29K33/00, B29K105/00, B29K105/16, B29K507/00, B29L31/00, B33Y10/00, B33Y70/00, B33Y80/00, C09D11/037, C09D11/107
CPC Code(s): C09D11/322
Organization: University of Virginia Patent Foundation
Inventor(s): Christopher Bruce Highley of Crozet VA (US) for University of Virginia Patent Foundation, Jack Whitewolf of Charlottesville VA (US) for University of Virginia Patent Foundation, M. Gregory Grewal of Charlottesville VA (US) for University of Virginia Patent Foundation
IPC Code(s): C12N5/00, B33Y10/00
CPC Code(s): C12N5/0068
Organization: General Electric Company
Inventor(s): Yan Cui of Greer SC (US) for General Electric Company, Jon C. Schaeffer of Greenville SC (US) for General Electric Company, Michael Douglas Arnett of Simpsonville SC (US) for General Electric Company, Matthew Joseph Laylock of Easley SC (US) for General Electric Company, Brian Lee Tollison of Honea Path SC (US) for General Electric Company
IPC Code(s): C22C19/05
CPC Code(s): C22C19/056
Organization: Unknown Organization
Inventor(s): Hamed NIROUMAND of Tehran (IR) for Unknown Organization, Lech Balachowski of Gdansk (PL) for Unknown Organization
IPC Code(s): E02D5/80
CPC Code(s): E02D5/801
Siemens Energy Global GmbH & Co. KG (20240354454). STOCHASTIC STRUCTURES simplified abstract
Organization: Siemens Energy Global GmbH & Co. KG
Inventor(s): Adam Clare of Nottingham (GB) for Siemens Energy Global GmbH & Co. KG, Jan-Hendrik Groth of Nottingham (GB) for Siemens Energy Global GmbH & Co. KG, Mirco Magnini of Nottingham (GB) for Siemens Energy Global GmbH & Co. KG, Christopher Tuck of Nottingham (GB) for Siemens Energy Global GmbH & Co. KG
IPC Code(s): G06F30/10, G06F30/20, G06F111/08, G06F113/10
CPC Code(s): G06F30/10
- A61B34/10
- A61F2/30
- CPC A61F2/30
- IX Innovation LLC
- A61L27/38
- A61F2/06
- A61L27/22
- A61L27/50
- A61L27/52
- B33Y10/00
- B33Y40/20
- B33Y70/00
- B33Y80/00
- CPC B33Y80/00
- TSINGHUA UNIVERSITY
- B05B7/26
- B05B1/00
- B05B1/14
- B05B13/02
- Applied Materials, Inc.
- B21F1/02
- B22F12/50
- CPC B22F12/50
- Nexa3D Inc.
- B22F1/10
- B22F3/16
- B22F10/18
- B22F10/28
- B22F10/64
- B33Y70/10
- CPC B33Y70/10
- Headmade Materials GmbH
- B22F3/11
- B22F7/00
- B22F10/32
- B22F10/34
- B22F10/366
- B22F10/38
- B22F10/80
- B23K26/082
- B33Y30/00
- B33Y50/02
- ASTROBOTIC TECHNOLOGY, INC.
- B22F10/16
- C08K3/00
- C08L81/10
- C08L91/06
- CPC C08L91/06
- B22F10/40
- B22F3/10
- B28B1/00
- CPC B33Y40/20
- General Electric Company
- B22F10/85
- B22F12/90
- CPC B33Y50/02
- Siemens Energy Global GmbH & Co. KG
- B23K26/03
- B23K26/342
- CPC B23K26/342
- ADDITIVE MONITORING, INC. dba Phase3D
- B25J15/08
- B22F12/88
- CPC B33Y70/00
- Virginia Commonwealth University
- B29C64/118
- B29C64/209
- B29C64/295
- B29C64/30
- CPC B29C64/30
- Unknown Organization
- B29C64/106
- B29C69/00
- B29K101/12
- C08J5/12
- CPC C08J5/12
- Guill Tool & Engineering Co., Inc.
- B29C64/135
- B29C64/273
- Georgia Tech Research Corporation
- B29C64/165
- B29C64/223
- B33Y40/10
- Sakuu Corporation
- B29C35/08
- B29C70/88
- B29K105/16
- B29K505/00
- B29L31/34
- H01C17/065
- CPC H01C17/065
- Hewlett-Packard Development Company, L.P.
- B29C64/194
- CPC B33Y30/00
- DYZE DESIGN
- B29C64/314
- CEM TECH LLC
- B29C64/241
- B29C64/171
- B29C64/245
- B29C64/264
- B29C64/386
- B29L31/00
- B33Y50/00
- 3D Systems, Inc.
- B29C64/35
- B08B5/04
- B22F12/67
- B29C64/153
- B29C64/214
- B33Y40/00
- CPC B33Y40/00
- G06F3/12
- G06Q10/0639
- G06Q50/04
- H04L67/01
- H04L69/16
- CPC H04L69/16
- Kemeera Inc., (dba Fathom)
- B29C64/393
- CPC B29C64/393
- International Business Machines Corporation
- B29C64/321
- SHENZHEN ANYCUBIC TECHNOLOGY CO., LTD.
- B29C64/40
- A61L27/20
- A61L27/24
- A61L27/56
- Carnegie Mellon University
- BOND HIGH PERFORMANCE 3D TECHNOLOGY B.V.
- B29C64/124
- B29L11/00
- Essilor International
- C08F291/00
- A61C7/08
- B29K96/02
- C08F2/50
- C08J5/18
- C08K5/23
- CPC C08K5/23
- ALIGN TECHNOLOGY, INC.
- C09D11/322
- A61C13/00
- B29C64/112
- B29K33/00
- B29K105/00
- B29K507/00
- C09D11/037
- C09D11/107
- CPC C09D11/107
- Stratasys Ltd.
- C12N5/00
- CPC B33Y10/00
- University of Virginia Patent Foundation
- C22C19/05
- CPC C22C19/05
- E02D5/80
- CPC E02D5/80
- G06F30/10
- G06F30/20
- G06F111/08
- G06F113/10
- CPC G06F113/10
- 3D Printing