3D Printing patent applications on May 30th, 2024

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Patent Applications for 3D Printing on May 30th, 2024

Number of patent applications containing '3D Printing' or its variations: 18

XEROX CORPORATION (20240173769). DYNAMIC IN-FLIGHT CHARACTERIZATION OF BUILD MATERIAL IN A 3D PRINTER AND SYSTEM AND METHODS THEREOF simplified abstract

Organization: XEROX CORPORATION

Inventor(s): Douglas K. HERRMANN of Webster NY (US) for XEROX CORPORATION, Jason M. LeFEVRE of Penfield NY (US) for XEROX CORPORATION, Seemit PRAHARAJ of Webster NY (US) for XEROX CORPORATION, Varun SAMBHY of Pittsford NY (US) for XEROX CORPORATION

IPC Code(s): B22D23/00, B22D46/00, B33Y10/00, B33Y30/00, B33Y50/02

CPC Code(s):


Unknown Organization (20240173772). METHODS AND MATERIALS FOR ADDITIVE MANUFACTURING simplified abstract

Organization: Unknown Organization

Inventor(s): Olivier SMILJANIC of Montréal (CA) for Unknown Organization

IPC Code(s): B22F10/28, B22F1/054, B22F1/16, B33Y10/00, B33Y70/10

CPC Code(s):


IHI CORPORATION (20240173774). ROTATING ADDITIVE MANUFACTURING DEVICE AND CONTROL DEVICE simplified abstract

Organization: IHI CORPORATION

Inventor(s): Kenta SHIONUMA of Tokyo (JP) for IHI CORPORATION, Yuichiro NAKAYAMA of Tokyo (JP) for IHI CORPORATION

IPC Code(s): B22F10/36, B22F10/28, B22F12/37, B22F12/90, B29C64/245, B29C64/268, B29C64/393, B33Y30/00, B33Y50/02

CPC Code(s):


National Cheng Kung University (20240173775). METHOD OF PRODUCING A MEDICAL IMPLANT ADOPTING ADDITIVE MANUFACTURING simplified abstract

Organization: National Cheng Kung University

Inventor(s): Ming-Long Yeh of Tainan (TW) for National Cheng Kung University, Guan-Lin Wu of Tainan (TW) for National Cheng Kung University, Chin-En Yen of Tainan (TW) for National Cheng Kung University, Ching Feng of Tainan (TW) for National Cheng Kung University

IPC Code(s): B22F12/41, B22F10/64

CPC Code(s):


SprintRay Inc. (20240173913). APPARATUS AND METHOD FOR THREE-DIMENSIONAL PRINTING simplified abstract

Organization: SprintRay Inc.

Inventor(s): Jing Zhang of Los Angeles CA (US) for SprintRay Inc.

IPC Code(s): B29C64/124, B29C64/188, B29C64/205, B29C64/241, B29C64/245, B29C64/255, B29C64/264, B29C64/393, B33Y10/00, B33Y30/00, B33Y40/20, B33Y50/02

CPC Code(s):


Eichenauer Heizelemente GmbH & Co. KG (20240173916). PRINT HEAD FOR A 3D PRINTER simplified abstract

Organization: Eichenauer Heizelemente GmbH & Co. KG

Inventor(s): Philippe Leininger of Haguenau (FR) for Eichenauer Heizelemente GmbH & Co. KG, Ulrich Schlachter of Herxheim (DE) for Eichenauer Heizelemente GmbH & Co. KG

IPC Code(s): B29C64/209, B29C64/295, B33Y30/00

CPC Code(s):


Concept Laser GmbH (20240173920). METHODS AND SYSTEMS FOR CALIBRATING AN ADDITIVE MANUFACTURING MACHINE simplified abstract

Organization: Concept Laser GmbH

Inventor(s): Christian Dicken of Michelau i. Ofr. (DE) for Concept Laser GmbH

IPC Code(s): B29C64/386, B33Y50/00, G01M11/08

CPC Code(s):


Fisher Controls International LLC (20240173921). METHODS AND APPARATUS FOR OPTIMALLY POSITIONING OBJECTS FOR AUTOMATED MACHINING simplified abstract

Organization: Fisher Controls International LLC

Inventor(s): ADAM BOYLE of SINGAPORE (SG) for Fisher Controls International LLC

IPC Code(s): B29C64/386, B22F3/24, B22F10/28, B22F10/47, B22F10/66, B22F10/80, B29C64/153, B29C64/40, B33Y10/00, B33Y50/00, G05B19/4099

CPC Code(s):


Markforged, Inc. (20240173922). 3D PATHING WITH COMPENSATION FOR NOZZLE MOVEMENT simplified abstract

Organization: Markforged, Inc.

Inventor(s): Corey Hazeltine Walsh of Belmont MA (US) for Markforged, Inc., Suhas Nawada of Concord MA (US) for Markforged, Inc., Benjamin Gallup of Acton MA (US) for Markforged, Inc.

IPC Code(s): B29C64/386, B22F10/85, B22F12/90, B29C64/118, B29C64/393, B33Y50/00, B33Y50/02

CPC Code(s):


Florida State University Research Foundation, Inc. (20240173924). SYSTEMS AND METHODS FOR ERROR REDUCTION IN THREE-DIMENSIONAL (3D) PRINTING simplified abstract

Organization: Florida State University Research Foundation, Inc.

Inventor(s): Hui Wang of Tallahassee FL (US) for Florida State University Research Foundation, Inc., An-Tsun Wei of Tallahassee FL (US) for Florida State University Research Foundation, Inc.

IPC Code(s): B29C64/393, B33Y30/00, B33Y50/02

CPC Code(s):


FINA TECHNOLOGY, INC. (20240174777). POLYPROPYLENES FOR ADDITIVE MANUFACTURING simplified abstract

Organization: FINA TECHNOLOGY, INC.

Inventor(s): Michael MCLEOD of Houston TX (US) for FINA TECHNOLOGY, INC., Fengkui LI of Houston TX (US) for FINA TECHNOLOGY, INC., Adrienne MUSIC of Pasadena TX (US) for FINA TECHNOLOGY, INC., Ngoc NGUYEN of Houston TX (US) for FINA TECHNOLOGY, INC.

IPC Code(s): C08F110/06, C08J9/232

CPC Code(s):


3D Systems, Inc. (20240174781). FLAME RESISTANT BUILD MATERIALS AND ASSOCIATED PRINTED 3D ARTICLES simplified abstract

Organization: 3D Systems, Inc.

Inventor(s): Khalil MOUSSA of Rock Hill SC (US) for 3D Systems, Inc.

IPC Code(s): C08F222/22, B29C64/106, B33Y10/00, B33Y70/00, B33Y80/00, C08K5/00, C08K5/521

CPC Code(s):


NIPPI, INCORPORATED (20240174976). BIOINK, MOLDED BODY, ARTICLE, AND METHOD FOR PRODUCING MOLDED BODY simplified abstract

Organization: NIPPI, INCORPORATED

Inventor(s): Shinomi Yagi of Tokyo (JP) for NIPPI, INCORPORATED, Keisuke Tanaka of Tokyo (JP) for NIPPI, INCORPORATED, Shunji Hattori of Tokyo (JP) for NIPPI, INCORPORATED, Kazunori Mizuno of Tokyo (JP) for NIPPI, INCORPORATED, Masataka Tanaka of Tokyo (JP) for NIPPI, INCORPORATED, Kazuyosi Sato of Tokyo (JP) for NIPPI, INCORPORATED

IPC Code(s): C12N5/00, B33Y10/00, B33Y70/00, B33Y80/00

CPC Code(s):


Dresser, LLC (20240175520). MANUFACTURING VALVE TRIM TO ABATE VALVE NOISE simplified abstract

Organization: Dresser, LLC

Inventor(s): Donald Stroman Sanders of Atlanta GA (US) for Dresser, LLC, Chad Eric Yates of Houston TX (US) for Dresser, LLC

IPC Code(s): F16K47/12, F16K1/54

CPC Code(s):


Intel Corporation (20240175640). VARIABLE DIMENSION HEAT PIPE simplified abstract

Organization: Intel Corporation

Inventor(s): Santosh Gangal of Bengaluru (IN) for Intel Corporation, Akarsha Kadadevaramath of Santa Clara CA (US) for Intel Corporation, Raghavendra S. Kanivihalli of Bangalore (IN) for Intel Corporation, Prakash Kurma Raju of Bangalore (IN) for Intel Corporation, Navneet Singh of Bangalore (IN) for Intel Corporation, Sarma Vmk Vedhanabhatla of Bengaluru (IN) for Intel Corporation

IPC Code(s): F28D15/04

CPC Code(s):


Carnegie Mellon University (20240177427). Mixed Reality Combination System simplified abstract

Organization: Carnegie Mellon University

Inventor(s): Jonathan CAGAN of Pittsburgh PA (US) for Carnegie Mellon University, Philip LEDUC of Pittsburgh PA (US) for Carnegie Mellon University

IPC Code(s): G06T19/00, A61B34/10, G02B27/01, G06F30/23, G06V10/10, G06V40/20

CPC Code(s):


FOXCONN (KUNSHAN) COMPUTER CONNECTOR CO., LTD. (20240177887). CORE WIRE AND METHOD OF MAKING SAME AND CABLE INCLUDING THE CORE WIRE simplified abstract

Organization: FOXCONN (KUNSHAN) COMPUTER CONNECTOR CO., LTD.

Inventor(s): CHUN-LIN LEE of New Taipei (TW) for FOXCONN (KUNSHAN) COMPUTER CONNECTOR CO., LTD., Jian-Guo Cai of Kunshan (CN) for FOXCONN (KUNSHAN) COMPUTER CONNECTOR CO., LTD., Juan Zheng of Kushan (CN) for FOXCONN (KUNSHAN) COMPUTER CONNECTOR CO., LTD., Lu-Yu Chang of New Taipei (TW) for FOXCONN (KUNSHAN) COMPUTER CONNECTOR CO., LTD.

IPC Code(s): H01B7/02, H01B1/02, H01B5/12, H01B13/22

CPC Code(s):


Advanced Manufacturing LLC (20240178428). System and Method for Continuous Fabrication of Graded Structured Units Using Additive Manufacturing simplified abstract

Organization: Advanced Manufacturing LLC

Inventor(s): Dongsheng Li of Farmington CT (US) for Advanced Manufacturing LLC, Thomas Maloney of Hebron CT (US) for Advanced Manufacturing LLC

IPC Code(s): H01M8/1253, B29C64/118, B29C64/268, B29C64/393, B33Y80/00, B29L31/34, B33Y10/00, B33Y50/02, B33Y70/00, H01M8/12

CPC Code(s):