3D Printing patent applications on July 25th, 2024
Patent Applications for 3D Printing on July 25th, 2024
Number of patent applications containing '3D Printing' or its variations: 26
Organization: Jiangnan University
Inventor(s): Zong Meng of Wuxi (CN) for Jiangnan University, Shaoyang Li of Wuxi (CN) for Jiangnan University
IPC Code(s): A23J3/14, A23D7/005, A23G1/00, A23J3/34
CPC Code(s): A23J3/14
Smile Fast Ltd (20240245489). DENTAL STENT simplified abstract
Organization: Smile Fast Ltd
Inventor(s): Thomas SEALEY of Penrith (GB) for Smile Fast Ltd, Olumide OJO of Penrith (GB) for Smile Fast Ltd
IPC Code(s): A61C5/00, A61C5/77, A61C5/80, A61C13/00, A61C19/06
CPC Code(s): A61C5/007
Organization: DePuy Synthes Products, Inc.
Inventor(s): Ryan C. Keefer of Warsaw IN (US) for DePuy Synthes Products, Inc., Bernice A. Gatrell of Warsaw IN (US) for DePuy Synthes Products, Inc., Andrew M. Hudson of Warsaw IN (US) for DePuy Synthes Products, Inc., Christel M. Wagner of Warsaw IN (US) for DePuy Synthes Products, Inc., Catherine Santis of Warsaw IN (US) for DePuy Synthes Products, Inc., Daniel N. Huff of Warsaw IN (US) for DePuy Synthes Products, Inc., Paul B. Sade, SR. of Warsaw IN (US) for DePuy Synthes Products, Inc.
IPC Code(s): A61F2/34, A61F2/30
CPC Code(s): A61F2/34
Organization: University of Maryland, College Park
Inventor(s): Sarah Van Belleghem of Washington DC (US) for University of Maryland, College Park, John Patrick Fisher of Kensington MD (US) for University of Maryland, College Park
IPC Code(s): A61L27/26, A61L27/36, A61L27/38, A61L27/52, A61L27/54, A61L27/58, B29C64/112, B29K105/00, B29L31/00, B33Y10/00, B33Y70/00, B33Y80/00
CPC Code(s): A61L27/26
Organization: Hayabusa Fightwear Inc.
Inventor(s): Ken CLEMENT of Kingston (CA) for Hayabusa Fightwear Inc., David ZIKAKIS of Kingston (CA) for Hayabusa Fightwear Inc., Zakaria ADREF of Kingston (CA) for Hayabusa Fightwear Inc., Craig CLEMENT of Kingston (CA) for Hayabusa Fightwear Inc.
IPC Code(s): A63B71/14, A41D19/015
CPC Code(s): A63B71/145
Organization: Siemens Aktiengesellschaft
Inventor(s): Raven Thomas Reisch of München (DE) for Siemens Aktiengesellschaft, Tobias Hauser of Bubesheim (DE) for Siemens Aktiengesellschaft, Tobias Kamps of München (DE) for Siemens Aktiengesellschaft
IPC Code(s): B22F10/85, B22F10/25, B22F12/90, B23K9/04, B23K26/03, B23K26/342, B33Y10/00, B33Y50/02
CPC Code(s): B22F10/85
Seurat Technologies, Inc. (20240246152). Light Valve Cooling System simplified abstract
Organization: Seurat Technologies, Inc.
Inventor(s): Drew W. Kissinger of Carlisle MA (US) for Seurat Technologies, Inc., Susanne Kras of Chelmsford MA (US) for Seurat Technologies, Inc., James A. DeMuth of Woburn MA (US) for Seurat Technologies, Inc., Andrew J. Bayramian of Marblehead MA (US) for Seurat Technologies, Inc., Francis L. Leard of Sudbury MA (US) for Seurat Technologies, Inc., Cote LeBlanc of Malden MA (US) for Seurat Technologies, Inc.
IPC Code(s): B22F12/20, B22F12/40, B29C64/268, B29K105/00, B33Y30/00, B33Y70/00, G02B7/02
CPC Code(s): B22F12/20
Organization: PRIMA ADDITIVE S.R.L.
Inventor(s): Fabio FERRARIO of Torino (IT) for PRIMA ADDITIVE S.R.L.
IPC Code(s): B22F12/42, B22F10/28, B22F12/45, B33Y30/00
CPC Code(s): B22F12/42
Robert Bosch GmbH (20240246154). PRINT HEAD FOR 3D PRINTING OF METALS simplified abstract
Organization: Robert Bosch GmbH
Inventor(s): Benjamin Schweizer of Horb (DE) for Robert Bosch GmbH, Eberhard Maier of Koengen (DE) for Robert Bosch GmbH
IPC Code(s): B22F12/53, B22F10/22, B33Y10/00, B33Y30/00
CPC Code(s): B22F12/53
DMG MORI CO., LTD. (20240246174). Processing Machine simplified abstract
Organization: DMG MORI CO., LTD.
Inventor(s): Takeshi OTAWA of NARA (JP) for DMG MORI CO., LTD.
IPC Code(s): B23K26/08, B22F10/28, B23K26/342, B33Y30/00
CPC Code(s): B23K26/0884
Organization: President and Fellows of Harvard College
Inventor(s): Jennifer A. Lewis of Cambridge MA (US) for President and Fellows of Harvard College, Brett G. Compton of Knoxville TN (US) for President and Fellows of Harvard College, Jordan R. Raney of Watertown MA (US) for President and Fellows of Harvard College, Thomas J. Ober of Cambridge MA (US) for President and Fellows of Harvard College
IPC Code(s): B29C64/118, B29C70/06, B29K105/12, B33Y10/00, B33Y70/10, B33Y80/00
CPC Code(s): B29C64/118
Organization: TORAY INDUSTRIES, INC.
Inventor(s): Taisuke Kogawa of Otsu-shi, Shiga (JP) for TORAY INDUSTRIES, INC., Koji Kadowaki of Kamakura-shi, Kanagawa (JP) for TORAY INDUSTRIES, INC., Masataka Nakamura of Otsu-shi, Shiga (JP) for TORAY INDUSTRIES, INC.
IPC Code(s): B29C64/118, B29C48/00, B29C48/05, B29C64/314, B29K67/00, B29K105/00, B33Y10/00, B33Y70/00
CPC Code(s): B29C64/118
Organization: GM Global Technology Operations LLC
Inventor(s): Raffaello Ardanese of Bloomfield Hills MI (US) for GM Global Technology Operations LLC, James Joseph Deininger of Sterling Heights MI (US) for GM Global Technology Operations LLC, Andrew Thomas Cunningham of Cambridge MA (US) for GM Global Technology Operations LLC, Mark Allen Leavitt of Oxford MI (US) for GM Global Technology Operations LLC
IPC Code(s): B29C64/147, B29C64/153, B29C64/314, B33Y10/00, B33Y30/00, B33Y40/10
CPC Code(s): B29C64/147
NEXA3D INC. (20240246292). 3D PRINTING SYSTEM simplified abstract
Organization: NEXA3D INC.
Inventor(s): Francis Kenyon Whetsell of Ventura CA (US) for NEXA3D INC., Miguel Cuevas Sandoval of Camarillo CA (US) for NEXA3D INC.
IPC Code(s): B29C64/255, B29C64/124, B33Y30/00
CPC Code(s): B29C64/255
Organization: Formlabs, Inc.
Inventor(s): Andrew M. Goldman of Stow MA (US) for Formlabs, Inc., Thomas Orr of Cambridge MA (US) for Formlabs, Inc., Dmitri Megretski of Carlisle MA (US) for Formlabs, Inc., Sung Sik Woo of Billerica MA (US) for Formlabs, Inc., Jonathan E. Evans of Somerville MA (US) for Formlabs, Inc., Daniel Viner of Somerville MA (US) for Formlabs, Inc., Alec B. Rudd of Medford MA (US) for Formlabs, Inc., Maxim Lobovsky of Cambridge MA (US) for Formlabs, Inc., Graham L. Medlin of Durham NC (US) for Formlabs, Inc., Hayley C. Whelan of Somerville MA (US) for Formlabs, Inc.
IPC Code(s): B29C64/282, B29C64/129, B29C64/268, B29C64/286, B33Y10/00, B33Y30/00, G02F1/1335, G02F1/13357, H01L25/075
CPC Code(s): B29C64/282
OECHSLER AG (20240246294). METHOD FOR MANUFACTURING A COATED OBJECT simplified abstract
Organization: OECHSLER AG
Inventor(s): Christian Fischer of Merkendorf (DE) for OECHSLER AG, Benedikt Santuens of Nuernberg (DE) for OECHSLER AG
IPC Code(s): B29C64/30, B29C35/02, B33Y40/20, C09D175/04, B29K75/00
CPC Code(s): B29C64/30
Organization: GUANGZHOU HEYGEARS IMC. INC
Inventor(s): Wei FENG of Guangzhou (CN) for GUANGZHOU HEYGEARS IMC. INC, Yong WANG of Guangzhou (CN) for GUANGZHOU HEYGEARS IMC. INC, Ming LI of Guangzhou (CN) for GUANGZHOU HEYGEARS IMC. INC
IPC Code(s): B29C64/386, B29L31/00, B33Y50/00, B33Y80/00
CPC Code(s): B29C64/386
Organization: Palo Alto Research Center Incorporated
Inventor(s): Morad Behandish of San Mateo CA (US) for Palo Alto Research Center Incorporated, Matthew Patterson of Raleigh NC (US) for Palo Alto Research Center Incorporated, Soren Taverniers of Palo Alto CA (US) for Palo Alto Research Center Incorporated, Dogan Timucin of Santa Cruz CA (US) for Palo Alto Research Center Incorporated, Christoforos Somarakis of Gilroy CA (US) for Palo Alto Research Center Incorporated, Svyatoslav Korneev of San Jose CA (US) for Palo Alto Research Center Incorporated
IPC Code(s): B29C64/393, B22F10/85, B33Y10/00, B33Y30/00, B33Y50/02
CPC Code(s): B29C64/393
Freemelt AB (20240246298). POWDER SMOKE DETECTION DURING ADDITIVE MANUFACTURING simplified abstract
Organization: Freemelt AB
Inventor(s): Robin STEPHANSEN of Mölndal (SE) for Freemelt AB, Ulf ACKELID of Göteborg (SE) for Freemelt AB
IPC Code(s): B29C64/393, B29C64/153, B29C64/268, B33Y50/00
CPC Code(s): B29C64/393
Organization: Fabric8Labs, Inc.
Inventor(s): David Pain of San Diego CA (US) for Fabric8Labs, Inc., Kareemullah Shaik of San Diego CA (US) for Fabric8Labs, Inc., Joshua Gillespie of Poway CA (US) for Fabric8Labs, Inc., Jeffrey Herman of San Diego CA (US) for Fabric8Labs, Inc.
IPC Code(s): B29C64/393, B29C64/264, B33Y10/00, B33Y30/00, B33Y50/02, C25D1/00, C25D17/10, C25D21/12
CPC Code(s): B29C64/393
Organization: Xerox Corporation
Inventor(s): Valerie M. Farrugia of Oakville (CA) for Xerox Corporation, Shivanthi Easwari Sriskandha of Mississauga (CA) for Xerox Corporation
IPC Code(s): C08F292/00, C08L77/06
CPC Code(s): C08F292/00
JABIL INC. (20240247103). POLYKETONE POWDER FOR LASER SINTERING simplified abstract
Organization: JABIL INC.
Inventor(s): Steven Kubiak of Edina MN (US) for JABIL INC., Zachary Peterson of New Hope MN (US) for JABIL INC., Nicholas John Dippel of Burnsville MN (US) for JABIL INC., Mathew Artin Torosian of Highlands Ranch CO (US) for JABIL INC., Thomas Fry of Victoria MN (US) for JABIL INC.
IPC Code(s): C08G67/02, B29B13/02, B29K71/00, B33Y70/00, C08J3/14
CPC Code(s): C08G67/02
Organization: Velan Inc.
Inventor(s): Luc David VERNHES of Hampstead (CA) for Velan Inc., Fadila KHELFAOUI of Montreal (CA) for Velan Inc., Alfredo Vincenzo COSTANTINI of Laval (CA) for Velan Inc., Duc Thanh TRAN of Montreal (CA) for Velan Inc.
IPC Code(s): F16L59/02
CPC Code(s): F16L59/021
Organization: COMPOSITE TECHNOLOGY R & D PTY LIMITED
Inventor(s): Jeffrey LANG of Sydney (AU) for COMPOSITE TECHNOLOGY R & D PTY LIMITED, Anthony J KHOURI of Sydney (AU) for COMPOSITE TECHNOLOGY R & D PTY LIMITED
IPC Code(s): F42B12/76, B22F10/25, B33Y10/00, B33Y80/00, F42B12/20, F42B33/00
CPC Code(s): F42B12/76
Organization: Gantri, Inc.
Inventor(s): Yi YANG of San Francisco CA (US) for Gantri, Inc.
IPC Code(s): G05B19/4099, B33Y50/00, B33Y80/00, G06F30/10, G06F113/10
CPC Code(s): G05B19/4099
Organization: BAE Systems Information and Electronic Systems Integration Inc.
Inventor(s): Jean L. Kubwimana of Merrimack NH (US) for BAE Systems Information and Electronic Systems Integration Inc., Alexander D. Johnson of Waltham MA (US) for BAE Systems Information and Electronic Systems Integration Inc., Jacob Tamasy of Nashua NH (US) for BAE Systems Information and Electronic Systems Integration Inc., James F. Fung of Manchester NH (US) for BAE Systems Information and Electronic Systems Integration Inc., Matthew J. Ney of Derry NH (US) for BAE Systems Information and Electronic Systems Integration Inc.
IPC Code(s): H01Q9/04, H01Q1/48, H01Q21/06
CPC Code(s): H01Q9/0414
- A23J3/14
- A23D7/005
- A23G1/00
- A23J3/34
- CPC A23J3/34
- Jiangnan University
- A61C5/00
- A61C5/77
- A61C5/80
- A61C13/00
- A61C19/06
- CPC A61C19/06
- Smile Fast Ltd
- A61F2/34
- A61F2/30
- CPC A61F2/30
- DePuy Synthes Products, Inc.
- A61L27/26
- A61L27/36
- A61L27/38
- A61L27/52
- A61L27/54
- A61L27/58
- B29C64/112
- B29K105/00
- B29L31/00
- B33Y10/00
- B33Y70/00
- B33Y80/00
- CPC B33Y80/00
- University of Maryland, College Park
- A63B71/14
- A41D19/015
- CPC A41D19/015
- Hayabusa Fightwear Inc.
- B22F10/85
- B22F10/25
- B22F12/90
- B23K9/04
- B23K26/03
- B23K26/342
- B33Y50/02
- CPC B33Y50/02
- Siemens Aktiengesellschaft
- B22F12/20
- B22F12/40
- B29C64/268
- B33Y30/00
- G02B7/02
- CPC G02B7/02
- Seurat Technologies, Inc.
- B22F12/42
- B22F10/28
- B22F12/45
- CPC B33Y30/00
- PRIMA ADDITIVE S.R.L.
- B22F12/53
- B22F10/22
- Robert Bosch GmbH
- B23K26/08
- DMG MORI CO., LTD.
- B29C64/118
- B29C70/06
- B29K105/12
- B33Y70/10
- President and Fellows of Harvard College
- B29C48/00
- B29C48/05
- B29C64/314
- B29K67/00
- CPC B33Y70/00
- TORAY INDUSTRIES, INC.
- B29C64/147
- B29C64/153
- B33Y40/10
- CPC B33Y40/10
- GM Global Technology Operations LLC
- B29C64/255
- B29C64/124
- NEXA3D INC.
- B29C64/282
- B29C64/129
- B29C64/286
- G02F1/1335
- G02F1/13357
- H01L25/075
- CPC H01L25/075
- Formlabs, Inc.
- B29C64/30
- B29C35/02
- B33Y40/20
- C09D175/04
- B29K75/00
- CPC B29K75/00
- OECHSLER AG
- B29C64/386
- B33Y50/00
- GUANGZHOU HEYGEARS IMC. INC
- B29C64/393
- Palo Alto Research Center Incorporated
- CPC B33Y50/00
- Freemelt AB
- B29C64/264
- C25D1/00
- C25D17/10
- C25D21/12
- CPC C25D21/12
- Fabric8Labs, Inc.
- C08F292/00
- C08L77/06
- CPC C08L77/06
- Xerox Corporation
- C08G67/02
- B29B13/02
- B29K71/00
- C08J3/14
- CPC C08J3/14
- JABIL INC.
- F16L59/02
- CPC F16L59/02
- Velan Inc.
- F42B12/76
- F42B12/20
- F42B33/00
- CPC F42B33/00
- COMPOSITE TECHNOLOGY R & D PTY LIMITED
- G05B19/4099
- G06F30/10
- G06F113/10
- CPC G06F113/10
- Gantri, Inc.
- H01Q9/04
- H01Q1/48
- H01Q21/06
- CPC H01Q21/06
- BAE Systems Information and Electronic Systems Integration Inc.
- 3D Printing