3D Printing patent applications on January 11th, 2024
Patent Applications for 3D Printing on January 11th, 2024
Number of patent applications containing '3D Printing' or its variations: 11
Organization: Bayer OY
Inventor(s): Harri JUKARAINEN of Kuusisto (FI) for Bayer OY, Jyrki PIHLAJA of Paimio (FI) for Bayer OY, Savante HOLMBERG of Turku (FI) for Bayer OY, Tuula VALO of Turku (FI) for Bayer OY, Anu-Liisa HONKA of Turku (FI) for Bayer OY, Jenny HOLLAENDER of Parainen (FI) for Bayer OY
IPC Code(s): A61K9/00, B33Y80/00, B29C64/118, A61K9/70, A61K31/405, A61K31/567, A61K47/32, A61K47/34
20240009357. 3D PRINTING OF BIOMEDICAL IMPLANTS simplified abstract (Northwestern University)
Organization: Northwestern University
Inventor(s): Jian Yang of Evanston IL (US) for Northwestern University, Evan C. Baker of Chicago IL (US) for Northwestern University, Henry O. T. Ware of Shawnee OK (US) for Northwestern University, Fan Zhou of Torrance CA (US) for Northwestern University, Cheng Sun of Willmette IL (US) for Northwestern University, Guillermo A. Ameer of Chicago IL (US) for Northwestern University, Robert Van Lith of Evanston IL (US) for Northwestern University
IPC Code(s): A61L31/06, C08J3/24, B33Y80/00, B29C64/135, B29C41/22, B29C41/00, B33Y30/00, B33Y70/00, B29C64/20, A61L31/16, A61L31/18, C09D167/06
Organization: HON HAI PRECISION INDUSTRY CO., LTD.
Inventor(s): MAO-SUNG CHEN of Hsinchu (TW) for HON HAI PRECISION INDUSTRY CO., LTD., WEI-LUN CHEN of Hsinchu (TW) for HON HAI PRECISION INDUSTRY CO., LTD., HONG-ZHENG LAI of Hsinchu (TW) for HON HAI PRECISION INDUSTRY CO., LTD., TSENG-LUNG CHANG of Hsinchu (TW) for HON HAI PRECISION INDUSTRY CO., LTD.
IPC Code(s): B02C17/20, B33Y80/00
Organization: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
Inventor(s): Rhys Mansell of Sant Cugat del Valles (ES) for HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P., Mohammad Jowkar of Sant Cugat del Valles (ES) for HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P., Carlos Eduardo Caballero Diaz of Sant Cugat del Valles (ES) for HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
IPC Code(s): B22F10/77, B29C64/357, B29C64/393, B22F10/322, B33Y30/00, B33Y50/02, B33Y40/00
Organization: Siemens Aktiengesellschaft
Inventor(s): Frank Heinrichsdorff of Teltow (DE) for Siemens Aktiengesellschaft, Darya Kastsian of Falkensee (DE) for Siemens Aktiengesellschaft, Daniel Reznik of Berlin (DE) for Siemens Aktiengesellschaft
IPC Code(s): B23K26/342, B22F10/28, B33Y10/00
Organization: FANUC CORPORATION
Inventor(s): Yuuki Kondou of Minamitsuru-gun, Yamanashi (JP) for FANUC CORPORATION
IPC Code(s): B25J9/16, B25J13/08, B33Y30/00, B29C64/209, B29C64/227, B33Y50/02, B29C64/393
Organization: Stratasys, Inc.
Inventor(s): Patrick Anderson of Maple Grove MN (US) for Stratasys, Inc., Dang Yang of Champlin MN (US) for Stratasys, Inc., Ross Michalkiewicz of Minneapolis MN (US) for Stratasys, Inc.
IPC Code(s): B29C64/118, B29C64/209, B29C64/255, B29C64/25, B29C64/321, B33Y10/00, B33Y30/00
Organization: Stratasys, Inc.
Inventor(s): Patrick Anderson of Maple Grove MN (US) for Stratasys, Inc., Dang Yang of Champlin MN (US) for Stratasys, Inc., Ross Michalkiewicz of Golden Valley MN (US) for Stratasys, Inc.
IPC Code(s): B29C64/255, B33Y30/00, B29C64/321, B33Y40/00, B65H75/18, B65H57/18
Organization: PANTHEON DESIGN LTD.
Inventor(s): Alex Wiecke of Vancouver (CA) for PANTHEON DESIGN LTD., Riley Gunn of Vancouver (CA) for PANTHEON DESIGN LTD., Zhenwei Cao of Vancouver (CA) for PANTHEON DESIGN LTD.
IPC Code(s): B29C64/393, B33Y50/02, B29C64/209
Organization: PUSAN NATIONAL UNIVERSITY INDUSTRY-UNIVERSITY COOPERATION FOUNDATION
Inventor(s): Yoon-Bo SHIM of Busan (KR) for PUSAN NATIONAL UNIVERSITY INDUSTRY-UNIVERSITY COOPERATION FOUNDATION, Deog Su PARK of Busan (KR) for PUSAN NATIONAL UNIVERSITY INDUSTRY-UNIVERSITY COOPERATION FOUNDATION, Sang Kon LEE of Busan (KR) for PUSAN NATIONAL UNIVERSITY INDUSTRY-UNIVERSITY COOPERATION FOUNDATION, Jae Hoon LEE of Ulsan (KR) for PUSAN NATIONAL UNIVERSITY INDUSTRY-UNIVERSITY COOPERATION FOUNDATION, Sang Hoon KIM of Anyang-si (KR) for PUSAN NATIONAL UNIVERSITY INDUSTRY-UNIVERSITY COOPERATION FOUNDATION
IPC Code(s): G01N27/407, B33Y80/00, B33Y70/10, G01N27/30
Organization: H3ALTH TECHNOLOGIES INC.
Inventor(s): Elias Gedamu of Calgary (CA) for H3ALTH TECHNOLOGIES INC.
IPC Code(s): G16H10/65, G16H50/30, H04W4/80, A45D31/00, G06T17/00
- A61K9/00
- B33Y80/00
- B29C64/118
- A61K9/70
- A61K31/405
- A61K31/567
- A61K47/32
- A61K47/34
- Bayer OY
- A61L31/06
- C08J3/24
- B29C64/135
- B29C41/22
- B29C41/00
- B33Y30/00
- B33Y70/00
- B29C64/20
- A61L31/16
- A61L31/18
- C09D167/06
- Northwestern University
- B02C17/20
- HON HAI PRECISION INDUSTRY CO., LTD.
- B22F10/77
- B29C64/357
- B29C64/393
- B22F10/322
- B33Y50/02
- B33Y40/00
- HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
- B23K26/342
- B22F10/28
- B33Y10/00
- Siemens Aktiengesellschaft
- B25J9/16
- B25J13/08
- B29C64/209
- B29C64/227
- FANUC CORPORATION
- B29C64/255
- B29C64/25
- B29C64/321
- Stratasys, Inc.
- B65H75/18
- B65H57/18
- PANTHEON DESIGN LTD.
- G01N27/407
- B33Y70/10
- G01N27/30
- PUSAN NATIONAL UNIVERSITY INDUSTRY-UNIVERSITY COOPERATION FOUNDATION
- G16H10/65
- G16H50/30
- H04W4/80
- A45D31/00
- G06T17/00
- H3ALTH TECHNOLOGIES INC.
- 3D Printing