3D Printing patent applications on August 29th, 2024
Patent Applications for 3D Printing on August 29th, 2024
Number of patent applications containing '3D Printing' or its variations: 23
Organization: BIPPECO
Inventor(s): Hyun Jin PARK of Seoul (KR) for BIPPECO, Hyun Jung KO of Siheung-si (KR) for BIPPECO
IPC Code(s): A23J3/22, A23J3/14, A23L33/105, A23P20/25
CPC Code(s): A23J3/227
Organization: BIPPECO
Inventor(s): Hyun Jin PARK of Seoul (KR) for BIPPECO, Sun Min KIM of Seoul (KR) for BIPPECO
IPC Code(s): A23P30/25, A23L17/00, A23L29/212, A23P20/15, A23P20/25, B33Y10/00, B33Y30/00, B33Y70/00, B33Y80/00
CPC Code(s): A23P30/25
KUMOVIS GMBH (20240285417). TRIAL IMPLANT simplified abstract
Organization: KUMOVIS GMBH
Inventor(s): Stefan LEONHARDT of München (DE) for KUMOVIS GMBH, Sebastian PAMMER of München (DE) for KUMOVIS GMBH
IPC Code(s): A61F2/46, A61F2/30
CPC Code(s): A61F2/4684
QDOT TECHNOLOGY LTD (20240286190). CO-SINTERING simplified abstract
Organization: QDOT TECHNOLOGY LTD
Inventor(s): Alasdair MORRISON of Didcot, Oxfordshire (GB) for QDOT TECHNOLOGY LTD, Tsun Holt WONG of Didcot, Oxfordshire (GB) for QDOT TECHNOLOGY LTD, Jack Robert NICHOLAS of Didcot, Oxfordshire (GB) for QDOT TECHNOLOGY LTD
IPC Code(s): B22F3/10, B22F5/10, B22F7/06, B33Y10/00, B33Y80/00
CPC Code(s): B22F3/1017
SAFRAN REOSC (20240286194). METHOD FOR FABRICATING A MIRROR BY 3D PRINTING simplified abstract
Organization: SAFRAN REOSC
Inventor(s): Jacques RODOLFO of Saint Pierre Du Perray (FR) for SAFRAN REOSC
IPC Code(s): B22F10/18, B22F3/10, B22F10/62, B22F10/64, B28B1/00, B28B11/24, B33Y10/00, B33Y30/00, B33Y40/20, C04B35/634, C04B35/638, C04B35/64
CPC Code(s): B22F10/18
Organization: The Johns Hopkins University
Inventor(s): Robert K. Mueller of Columbia MD (US) for The Johns Hopkins University, Gianna M. Valentino of Baltimore MD (US) for The Johns Hopkins University
IPC Code(s): B22F10/366, B22F10/28, B22F12/30, B33Y10/00, B33Y30/00, B33Y40/10, B33Y50/02
CPC Code(s): B22F10/366
Organization: FORMALLOY TECHNOLOGIES, INC.
Inventor(s): Jeffrey L. RIEMANN of Spring Valley CA (US) for FORMALLOY TECHNOLOGIES, INC., Kurt R. Moran of Spring Valley CA (US) for FORMALLOY TECHNOLOGIES, INC.
IPC Code(s): B23K26/342, B22F10/28, B22F10/36, B22F10/85, B23K26/03, B33Y10/00, B33Y30/00, B33Y50/02
CPC Code(s): B23K26/342
Organization: KENNAMETAL INC.
Inventor(s): Paul D. Prichard of Greensburg PA (US) for KENNAMETAL INC.
IPC Code(s): B28B1/00, B22F7/02, B22F10/14, B22F10/28, B22F10/34, B22F10/38, B22F10/64, B22F10/66, B23K15/00, B33Y10/00, B33Y70/00
CPC Code(s): B28B1/001
Organization: NANJING UNIVERSITY OF AERONAUTICS AND ASTRONAUTICS
Inventor(s): Zhongde SHAN of Nanjing (CN) for NANJING UNIVERSITY OF AERONAUTICS AND ASTRONAUTICS, Congze FAN of Nanjing (CN) for NANJING UNIVERSITY OF AERONAUTICS AND ASTRONAUTICS, Yiwei CHEN of Nanjing (CN) for NANJING UNIVERSITY OF AERONAUTICS AND ASTRONAUTICS, Jinghua ZHENG of Nanjing (CN) for NANJING UNIVERSITY OF AERONAUTICS AND ASTRONAUTICS, Wenzhe SONG of Nanjing (CN) for NANJING UNIVERSITY OF AERONAUTICS AND ASTRONAUTICS, Jingxuan WANG of Nanjing (CN) for NANJING UNIVERSITY OF AERONAUTICS AND ASTRONAUTICS
IPC Code(s): B29B11/10, B29B11/16, B29B15/14, B29C64/314, B33Y40/10
CPC Code(s): B29B11/10
Organization: Unknown Organization
Inventor(s): Ivan Li Chuen Yeoh of Wesley Chapel FL (US) for Unknown Organization
IPC Code(s): B29C64/141, B22F10/18, B22F10/62, B22F10/64, B22F10/66, B22F10/80, B22F12/00, B22F12/13, B22F12/50, B22F12/90, B28B1/00, B29C64/20, B29C70/22, B29C70/38, B33Y10/00, B33Y30/00, B33Y70/00
CPC Code(s): B29C64/141
Organization: General Electric Company
Inventor(s): Justin Mamrak of Loveland OH (US) for General Electric Company, MacKenzie Ryan Redding of Mason OH (US) for General Electric Company
IPC Code(s): B29C64/153, B22F10/14, B22F10/25, B22F10/28, B22F10/32, B22F10/322, B22F10/50, B22F10/77, B22F12/00, B22F12/20, B22F12/49, B22F12/67, B22F12/70, B29C64/371, B33Y10/00, B33Y30/00
CPC Code(s): B29C64/153
Organization: Greene,Tweed Technologies, Inc.
Inventor(s): Mookkan Periyasamy of Wilmington DE (US) for Greene,Tweed Technologies, Inc., Ronald R. Campbell of Lansdale PA (US) for Greene,Tweed Technologies, Inc., Joey L. Mead of Boston MA (US) for Greene,Tweed Technologies, Inc., David O. Kazmer of Boston MA (US) for Greene,Tweed Technologies, Inc., Stiven Kodra of Boston MA (US) for Greene,Tweed Technologies, Inc., A. A. Mubasshir of Boston MA (US) for Greene,Tweed Technologies, Inc.
IPC Code(s): B29C64/209, B29C64/227, B29C64/295, B29C64/321, B29K19/00, B29L31/26, B33Y30/00, B33Y70/00, B33Y80/00
CPC Code(s): B29C64/209
Textron Aviation Inc. (20240286349). 3D Printer Head simplified abstract
Organization: Textron Aviation Inc.
Inventor(s): Ron Tozier of Andover KS (US) for Textron Aviation Inc., Kyra Rubinstein of Wichita KS (US) for Textron Aviation Inc., Ryan Binter of Wichita KS (US) for Textron Aviation Inc.
IPC Code(s): B29C64/209, B29C64/118, B29C64/232, B29C64/236, B29C64/25, B29C64/336, B33Y10/00, B33Y30/00
CPC Code(s): B29C64/209
Organization: PERI SE
Inventor(s): Christian MAUCHER of Mindelzell (DE) for PERI SE, Matthias STEPPICH of Guenzburg (DE) for PERI SE, Franz WINTER of Pfaffenhofen (DE) for PERI SE
IPC Code(s): B29C64/232, B29C64/236, B29C64/241, B33Y30/00
CPC Code(s): B29C64/232
Textron Aviation Inc. (20240286356). Nozzle Scraper simplified abstract
Organization: Textron Aviation Inc.
Inventor(s): Ron Tozier of Andover KS (US) for Textron Aviation Inc., Kyra Rubinstein of Wichita KS (US) for Textron Aviation Inc., Ryan Binter of Wichita KS (US) for Textron Aviation Inc.
IPC Code(s): B29C64/35, B29C64/118, B29C64/209, B29C64/232, B29C64/241, B33Y30/00, B33Y40/00
CPC Code(s): B29C64/35
Organization: Moon Creative Lab Inc.
Inventor(s): Danit PELEG of Tel Aviv (IL) for Moon Creative Lab Inc.
IPC Code(s): B29C64/40, B29C64/118, B29C64/188, B29K29/00, B29K75/00, B29L31/48, B33Y10/00, B33Y40/20, B33Y70/00, B33Y80/00
CPC Code(s): B29C64/40
Organization: Rohr, Inc.
Inventor(s): Daniel O. Ursenbach of El Cajon CA (US) for Rohr, Inc.
IPC Code(s): B29C70/38, B29C33/52, B29C64/165, B29C64/188, B29C64/268, B29C64/295, B29C64/30, B29C64/40, B29C70/68, B29L31/00, B33Y10/00, B33Y30/00, B33Y80/00
CPC Code(s): B29C70/386
Organization: Nippon Kornmeyer Carbon Group GmbH
Inventor(s): Torsten KORNMEYER of Königswinter (DE) for Nippon Kornmeyer Carbon Group GmbH, David KLEIN of Hennef (Sieg) (DE) for Nippon Kornmeyer Carbon Group GmbH, Michael GERADS of Bonn (DE) for Nippon Kornmeyer Carbon Group GmbH
IPC Code(s): C04B35/524, B29C64/124, B29C64/35, B29K33/20, B33Y10/00, B33Y40/20, B33Y70/10, C04B35/626, C04B35/636, C04B35/64
CPC Code(s): C04B35/524
Organization: ARKEMA FRANCE
Inventor(s): Ornella ZOVI of Serquigny (FR) for ARKEMA FRANCE, Jean-Charles DURAND of Serquigny (FR) for ARKEMA FRANCE
IPC Code(s): C08J3/12, B29C64/314, B29K45/00, B29K77/00, B29K105/00, B29K105/16, B33Y70/00, C08K5/134, C08K5/20, C08K5/372, C08K5/42
CPC Code(s): C08J3/12
Organization: Stratasys Ltd.
Inventor(s): Lev KUNO of Tzur-Hadassah (IL) for Stratasys Ltd.
IPC Code(s): C08L33/10, B29C64/106, B29C64/277, B29K33/00, B33Y10/00, B33Y70/00, C08K3/36, C08K9/04
CPC Code(s): C08L33/10
Organization: HARNYSS IP, LLC
Inventor(s): Henry U. Lee of West Bloomfield MI (US) for HARNYSS IP, LLC, Baoquan Huang of Troy MI (US) for HARNYSS IP, LLC, Benjamin S. Chao of Troy MI (US) for HARNYSS IP, LLC, Kirby Alan Smith of Fort Worth TX (US) for HARNYSS IP, LLC
IPC Code(s): C22C30/00, B22F10/28, B22F12/41, B33Y10/00, B33Y70/00, B33Y80/00, F17C1/10, F17C1/14, F17C11/00
CPC Code(s): C22C30/00
Organization: Unknown Organization
Inventor(s): SHUN-PING HUANG of Hsinchu County (TW) for Unknown Organization
IPC Code(s): H01L23/367, H01L23/00, H01L23/373, H01L25/00, H01L25/065
CPC Code(s): H01L23/3672
Organization: Northeastern University
Inventor(s): Hongli Zhu of Newton MA (US) for Northeastern University, Ying Wang of Boston MA (US) for Northeastern University
IPC Code(s): H01M4/04, H01M4/02, H01M4/131, H01M4/1391, H01M4/525
CPC Code(s): H01M4/0414
- A23J3/22
- A23J3/14
- A23L33/105
- A23P20/25
- CPC A23P20/25
- BIPPECO
- A23P30/25
- A23L17/00
- A23L29/212
- A23P20/15
- B33Y10/00
- B33Y30/00
- B33Y70/00
- B33Y80/00
- CPC B33Y80/00
- A61F2/46
- A61F2/30
- CPC A61F2/30
- KUMOVIS GMBH
- B22F3/10
- B22F5/10
- B22F7/06
- QDOT TECHNOLOGY LTD
- B22F10/18
- B22F10/62
- B22F10/64
- B28B1/00
- B28B11/24
- B33Y40/20
- C04B35/634
- C04B35/638
- C04B35/64
- CPC C04B35/64
- SAFRAN REOSC
- B22F10/366
- B22F10/28
- B22F12/30
- B33Y40/10
- B33Y50/02
- CPC B33Y50/02
- The Johns Hopkins University
- B23K26/342
- B22F10/36
- B22F10/85
- B23K26/03
- FORMALLOY TECHNOLOGIES, INC.
- B22F7/02
- B22F10/14
- B22F10/34
- B22F10/38
- B22F10/66
- B23K15/00
- CPC B33Y70/00
- KENNAMETAL INC.
- B29B11/10
- B29B11/16
- B29B15/14
- B29C64/314
- CPC B33Y40/10
- NANJING UNIVERSITY OF AERONAUTICS AND ASTRONAUTICS
- B29C64/141
- B22F10/80
- B22F12/00
- B22F12/13
- B22F12/50
- B22F12/90
- B29C64/20
- B29C70/22
- B29C70/38
- Unknown Organization
- B29C64/153
- B22F10/25
- B22F10/32
- B22F10/322
- B22F10/50
- B22F10/77
- B22F12/20
- B22F12/49
- B22F12/67
- B22F12/70
- B29C64/371
- CPC B33Y30/00
- General Electric Company
- B29C64/209
- B29C64/227
- B29C64/295
- B29C64/321
- B29K19/00
- B29L31/26
- Greene,Tweed Technologies, Inc.
- B29C64/118
- B29C64/232
- B29C64/236
- B29C64/25
- B29C64/336
- Textron Aviation Inc.
- B29C64/241
- PERI SE
- B29C64/35
- B33Y40/00
- CPC B33Y40/00
- B29C64/40
- B29C64/188
- B29K29/00
- B29K75/00
- B29L31/48
- Moon Creative Lab Inc.
- B29C33/52
- B29C64/165
- B29C64/268
- B29C64/30
- B29C70/68
- B29L31/00
- Rohr, Inc.
- C04B35/524
- B29C64/124
- B29K33/20
- B33Y70/10
- C04B35/626
- C04B35/636
- Nippon Kornmeyer Carbon Group GmbH
- C08J3/12
- B29K45/00
- B29K77/00
- B29K105/00
- B29K105/16
- C08K5/134
- C08K5/20
- C08K5/372
- C08K5/42
- CPC C08K5/42
- ARKEMA FRANCE
- C08L33/10
- B29C64/106
- B29C64/277
- B29K33/00
- C08K3/36
- C08K9/04
- CPC C08K9/04
- Stratasys Ltd.
- C22C30/00
- B22F12/41
- F17C1/10
- F17C1/14
- F17C11/00
- CPC F17C11/00
- HARNYSS IP, LLC
- H01L23/367
- H01L23/00
- H01L23/373
- H01L25/00
- H01L25/065
- CPC H01L25/065
- H01M4/04
- H01M4/02
- H01M4/131
- H01M4/1391
- H01M4/525
- CPC H01M4/525
- Northeastern University
- 3D Printing