20240088006.SEMICONDUCTOR PACKAGE simplified abstract (samsung electronics co., ltd.)
Contents
- 1 SEMICONDUCTOR PACKAGE
SEMICONDUCTOR PACKAGE
Organization Name
Inventor(s)
Sangcheon Park of Suwon-si (KR)
Unbyoung Kang of Suwon-si (KR)
Hyunchul Jung of Suwon-si (KR)
SEMICONDUCTOR PACKAGE - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240088006 titled 'SEMICONDUCTOR PACKAGE
Simplified Explanation
The semiconductor package described in the abstract includes a substrate with connecting circuits, through silicon via (TSV) structures, passivation layers, and bumping pads with different seed layers. The seed layers have different reactivities to water.
- The semiconductor package includes a substrate with connecting circuits and TSV structures.
- The package has passivation layers on both surfaces of the substrate.
- Bumping pads with different seed layers are arranged inside the passivation layers.
- The seed layers have different reactivities to water, providing unique properties to the bumping pads.
Potential Applications
The technology described in this patent application could be applied in:
- Semiconductor manufacturing
- Integrated circuit packaging
- Microelectronics industry
Problems Solved
This technology addresses issues related to:
- Enhanced reliability of semiconductor packages
- Improved electrical performance
- Protection against environmental factors
Benefits
The benefits of this technology include:
- Increased durability and longevity of semiconductor packages
- Enhanced electrical connectivity
- Resistance to water-related damage
Potential Commercial Applications
The potential commercial applications of this technology could be in:
- Consumer electronics
- Automotive electronics
- Telecommunications industry
Possible Prior Art
One possible prior art related to this technology is the use of different seed layers in semiconductor packaging to enhance the properties of bumping pads.
Unanswered Questions
How does this technology compare to existing semiconductor packaging methods in terms of cost-effectiveness?
This article does not provide information on the cost-effectiveness of implementing this technology compared to traditional semiconductor packaging methods.
What are the environmental implications of using materials with different reactivities to water in semiconductor packaging?
The article does not address the environmental impact of using materials with different reactivities to water in semiconductor packaging.
Original Abstract Submitted
provided is a semiconductor package including a substrate including a first surface and a second surface opposite to the first surface, a connecting circuit arranged on the first surface of the substrate, a through silicon via (tsv) structure penetrating the substrate, a first passivation layer arranged on the connecting circuit, a second passivation layer arranged on the second surface, a first bumping pad arranged inside the first passivation layer, and a second bumping pad arranged inside the second passivation layer, wherein the first bumping pad includes a first pad plug, and a first seed layer surrounding a lower surface and sidewalls of the first pad plug, wherein the second bumping pad includes a second pad plug, and a second seed layer surrounding an upper surface and sidewalls of the second pad plug, and wherein the first seed layer and the second seed layer include materials having different reactivities to water.
