20240087998.SEMICONDUCTOR PACKAGE simplified abstract (samsung electronics co., ltd.)
Contents
- 1 SEMICONDUCTOR PACKAGE
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 SEMICONDUCTOR PACKAGE - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 How does this technology impact the overall cost of electronic devices?
- 1.11 What are the environmental implications of this semiconductor packaging design?
- 1.12 Original Abstract Submitted
SEMICONDUCTOR PACKAGE
Organization Name
Inventor(s)
SEMICONDUCTOR PACKAGE - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240087998 titled 'SEMICONDUCTOR PACKAGE
Simplified Explanation
The semiconductor package described in the patent application includes a first semiconductor device with a semiconductor chip, an interposer made of silicon and electrically connected to the first semiconductor device, a second semiconductor device, and a substrate. The interposer and the second semiconductor device are provided on the substrate but apart from each other, with the interposer being electrically connected to the second semiconductor device. The volumes of the first and second shapes, where the first semiconductor device and interposer overlap the substrate, are compared.
- The semiconductor package includes a first semiconductor device with a semiconductor chip.
- An interposer made of silicon is electrically connected to the first semiconductor device.
- A second semiconductor device is also included in the package.
- The interposer and the second semiconductor device are provided on a substrate but are apart from each other.
- The interposer is electrically connected to the second semiconductor device.
- The volumes of the shapes in which the first semiconductor device and interposer overlap the substrate are compared.
Potential Applications
The technology described in this patent application could be applied in various electronic devices such as smartphones, tablets, laptops, and other consumer electronics that require compact and efficient semiconductor packaging solutions.
Problems Solved
This technology solves the problem of optimizing space utilization in semiconductor packaging by efficiently arranging the semiconductor devices and interposer on the substrate while ensuring proper electrical connections between them.
Benefits
The benefits of this technology include improved performance, reduced footprint, enhanced thermal management, and increased reliability in electronic devices due to the optimized semiconductor packaging design.
Potential Commercial Applications
"Optimized Semiconductor Packaging Design for Electronic Devices"
Possible Prior Art
There is no known prior art for this specific semiconductor packaging design.
Unanswered Questions
How does this technology impact the overall cost of electronic devices?
The cost implications of implementing this semiconductor packaging design are not discussed in the patent application. It would be interesting to know if the optimized design leads to cost savings in manufacturing or if it requires additional resources, thus affecting the overall cost of electronic devices.
What are the environmental implications of this semiconductor packaging design?
The environmental impact of this technology, such as its energy efficiency, recyclability, and potential waste generation during manufacturing, is not addressed in the patent application. Understanding the environmental implications of this semiconductor packaging design is crucial in assessing its sustainability in electronic device production.
Original Abstract Submitted
a semiconductor package including a first semiconductor device including a semiconductor chip; an interposer including silicon and electrically connected to the first semiconductor device, wherein the first semiconductor is provided on the interposer; a second semiconductor device; and a substrate, wherein the interposer and the second semiconductor device, are provided on the substrate apart from each other, and wherein the interposer is electrically connected to the second semiconductor device; wherein a first volume of a first shape, in which the first semiconductor device overlaps an upper surface of the substrate, is less than or equal to a second volume of a second shape, in which the interposer overlaps an upper surface of the substrate.
