20240087976.SEMICONDUCTOR PACKAGE simplified abstract (samsung electronics co., ltd.)
Contents
- 1 SEMICONDUCTOR PACKAGE
SEMICONDUCTOR PACKAGE
Organization Name
Inventor(s)
Youngdeuk Kim of Suwon-si (KR)
SEMICONDUCTOR PACKAGE - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240087976 titled 'SEMICONDUCTOR PACKAGE
Simplified Explanation
The semiconductor package described in the patent application includes a first substrate, a first chip structure with at least one chip on the first substrate, a heat dissipation member on the first chip structure, and a metal thermal interfacial material (TIM) on the heat dissipation member.
- The semiconductor package comprises a first substrate and a first chip structure with at least one chip.
- A heat dissipation member is placed on the first chip structure to dissipate heat effectively.
- The heat dissipation member includes a heat dissipation plate with a seed metal layer on its surface.
- A metal thermal interfacial material (TIM) is applied on the seed metal layer to enhance thermal conductivity.
Potential Applications
The technology described in the patent application could be applied in various electronic devices such as computers, smartphones, and servers to improve heat dissipation and overall performance.
Problems Solved
This technology addresses the issue of heat buildup in electronic devices, which can lead to decreased performance and potential damage to components. By enhancing heat dissipation, the semiconductor package can help maintain optimal operating temperatures.
Benefits
- Improved heat dissipation efficiency - Enhanced overall performance of electronic devices - Protection of components from heat-related damage
Potential Commercial Applications
"Enhanced Heat Dissipation Technology for Electronic Devices" could be utilized in the manufacturing of high-performance computers, servers, and other electronic devices where heat management is crucial for optimal functioning.
Possible Prior Art
Prior art may include existing semiconductor packaging technologies that focus on heat dissipation and thermal management in electronic devices. One example could be the use of heat sinks or thermal interface materials in similar applications.
Unanswered Questions
How does this technology compare to traditional heat dissipation methods in terms of efficiency and cost-effectiveness?
The article does not provide a direct comparison between this technology and traditional heat dissipation methods. It would be beneficial to understand the advantages and limitations of this innovation in relation to existing solutions.
What impact could this technology have on the design and form factor of electronic devices?
The potential influence of this technology on the design and size of electronic devices is not discussed in the article. Exploring how this innovation may affect the overall form factor and aesthetics of products could be valuable information for manufacturers and designers.
Original Abstract Submitted
provided is a semiconductor package including a first substrate, a first chip structure on the first substrate, the first chip structure including at least one chip, a heat dissipation member on the first chip structure, the heat dissipation member including a heat dissipation plate including a first surface facing the first chip structure and a second surface opposite to the first surface and a seed metal layer on the second surface of the heat dissipation plate, and a metal thermal interfacial material (tim) on the seed metal layer.
