20240085282.APPARATUS FOR MANUFACTURING ANALYTICAL SEMICONDUCTOR SAMPLES AND METHOD FOR MANUFACTURING ANALYTICAL SEMICONDUCTOR SAMPLES BY USING THE SAME simplified abstract (samsung electronics co., ltd.)

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APPARATUS FOR MANUFACTURING ANALYTICAL SEMICONDUCTOR SAMPLES AND METHOD FOR MANUFACTURING ANALYTICAL SEMICONDUCTOR SAMPLES BY USING THE SAME

Organization Name

samsung electronics co., ltd.

Inventor(s)

Min Chul Jo of Suwon-si (KR)

Sang Hyun Park of Suwon-si (KR)

Su Jin Shin of Suwon-si (KR)

Gil Ho Gu of Suwon-si (KR)

Dae Gon Yu of Suwon-si (KR)

So Yeon Lee of Suwon-si (KR)

Yun Bin Jeong of Suwon-si (KR)

APPARATUS FOR MANUFACTURING ANALYTICAL SEMICONDUCTOR SAMPLES AND METHOD FOR MANUFACTURING ANALYTICAL SEMICONDUCTOR SAMPLES BY USING THE SAME - A simplified explanation of the abstract

This abstract first appeared for US patent application 20240085282 titled 'APPARATUS FOR MANUFACTURING ANALYTICAL SEMICONDUCTOR SAMPLES AND METHOD FOR MANUFACTURING ANALYTICAL SEMICONDUCTOR SAMPLES BY USING THE SAME

Simplified Explanation

The method described in the abstract is for manufacturing analytical semiconductor samples using an apparatus that minimizes feedback time by creating an environmentally friendly and large viewing surface. The steps involved include mounting the samples to a holder, discharging deionized water onto a polishing plate, grinding the samples, determining if the desired viewing surface has been achieved, and transferring the samples for analysis if the surface meets the criteria.

  • Mounting analytical semiconductor samples to a holder
  • Discharging deionized water onto a polishing plate
  • Grinding the samples on the polishing plate
  • Determining if the desired viewing surface has been achieved
  • Transferring the samples for analysis if the surface meets the criteria

Potential Applications

The technology can be used in semiconductor manufacturing, quality control processes, and research and development in the electronics industry.

Problems Solved

This technology streamlines the process of manufacturing analytical semiconductor samples, reducing feedback time and ensuring a large and environmentally friendly viewing surface for analysis.

Benefits

The benefits of this technology include improved efficiency in semiconductor sample manufacturing, enhanced quality control processes, and more accurate analysis of semiconductor samples.

Potential Commercial Applications

Potential commercial applications of this technology include semiconductor manufacturing companies, research institutions, and quality control laboratories in the electronics industry.

Possible Prior Art

One possible prior art could be the use of similar apparatus and methods in the semiconductor industry for manufacturing and analyzing semiconductor samples.

What are the specific environmental benefits of using an environmentally friendly viewing surface in semiconductor manufacturing?

Using an environmentally friendly viewing surface in semiconductor manufacturing can reduce the environmental impact of the manufacturing process by minimizing the use of harmful chemicals and materials. It can also contribute to a more sustainable and eco-friendly approach to semiconductor production.

How does the large viewing surface provided by this technology improve the analysis of semiconductor samples?

The large viewing surface allows for more comprehensive analysis of the semiconductor samples, providing researchers and analysts with a clearer and more detailed view of the samples. This can lead to more accurate results and insights into the properties and characteristics of the semiconductor materials.


Original Abstract Submitted

there is provide a method for manufacturing analytical semiconductor samples by using an apparatus for manufacturing analytical semiconductor samples, which minimizes a feedback time by manufacturing a viewing surface that is environment-friendly and has a large area. the method comprising mounting the analytical semiconductor samples to a holder; discharging deionized (di) water to an upper surface of a polishing plate through a di water nozzle; grinding the analytical semiconductor samples with the upper surface of the polishing plat; determining whether a desired viewing surface of the analytical semiconductor samples has been acquired after the grinding of the analytical semiconductor samples; and transferring the analytical semiconductor samples to analyze the viewing surface of the ground analytical semiconductor samples based on a determination that the desired viewing surface of the analytical semiconductor samples has been acquired.