20240079784.Electronic Device Having Compact Grounding Structure simplified abstract (apple inc.)
Contents
- 1 Electronic Device Having Compact Grounding Structure
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 Electronic Device Having Compact Grounding Structure - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 How does the compressive foam impact the overall performance of the device?
- 1.11 What materials are used for the dimpled pad and how do they impact the performance of the device?
- 1.12 Original Abstract Submitted
Electronic Device Having Compact Grounding Structure
Organization Name
Inventor(s)
Victor C. Lee of Santa Clara CA (US)
Jingni Zhong of Santa Clara CA (US)
Ming Chen of Cupertino CA (US)
Bhaskara R. Rupakula of San Jose CA (US)
Yiren Wang of Cupertino CA (US)
Yuan Tao of Santa Clara CA (US)
Christopher Q. Ma of San Francisco CA (US)
Zhiheng Zhou of Zhangjiagang (CN)
Sherry Cao of San Francisco CA (US)
Kevin M. Froese of Verona WI (US)
Hongfei Hu of Cupertino CA (US)
Mattia Pascolini of San Francisco CA (US)
Electronic Device Having Compact Grounding Structure - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240079784 titled 'Electronic Device Having Compact Grounding Structure
Simplified Explanation
An electronic device with a flexible printed circuit and a light source module mounted to a metal cowling is described in the patent application. The printed circuit is interposed between the cowling and a conductive support plate, with a ground trace coupled to the resonating element. A dimpled pad on the printed circuit presses against the support plate, forming a return path to ground for the resonating element.
- Antenna with resonating element
- Light source module mounted to flexible printed circuit and metal cowling
- Emitting light through rear housing wall
- Printed circuit interposed between cowling and support plate
- Ground trace coupled to resonating element
- Dimpled pad on printed circuit presses against support plate
- Compressive foam exerts force on printed circuit
- Dimpled pad forms return path to ground for resonating element
- Occupies less height than other structures
Potential Applications
This technology could be applied in various electronic devices that require antennas and light sources, such as smartphones, tablets, and IoT devices.
Problems Solved
This innovation solves the problem of efficiently integrating an antenna and a light source module in an electronic device while maintaining a compact design.
Benefits
The benefits of this technology include improved space utilization, enhanced signal reception, and simplified manufacturing processes for electronic devices.
Potential Commercial Applications
The potential commercial applications of this technology include consumer electronics, telecommunications equipment, and smart home devices.
Possible Prior Art
One possible prior art for this technology could be the integration of antennas and light sources in electronic devices using separate components, which may result in a less efficient design.
Unanswered Questions
How does the compressive foam impact the overall performance of the device?
The compressive foam is used to exert a force on the flexible printed circuit, but it is not clear how this may affect the functionality or durability of the device.
What materials are used for the dimpled pad and how do they impact the performance of the device?
The materials used for the dimpled pad are not specified in the abstract, so it is unclear how they may affect the overall performance or reliability of the device.
Original Abstract Submitted
an electronic device may be provided with an antenna having a resonating element and a light source module mounted to a flexible printed circuit and a metal cowling. the module may emit light through a rear housing wall. the printed circuit may be interposed between the metal cowling and a conductive support plate in the rear housing wall. the printed circuit may include a ground trace coupled to the resonating element. a dimpled pad may couple the ground trace to the support plate. compressive foam may be used to exert a force against the flexible printed circuit that presses the dimpled pad against the conductive support plate. the ground trace and the dimpled pad may form a return path to ground for the resonating element. the dimpled pad may occupy less height within the device than other structures such as metal springs.
- Apple inc.
- Han Wang of Campbell CA (US)
- Victor C. Lee of Santa Clara CA (US)
- Jingni Zhong of Santa Clara CA (US)
- Ming Chen of Cupertino CA (US)
- Bhaskara R. Rupakula of San Jose CA (US)
- Yiren Wang of Cupertino CA (US)
- Yuan Tao of Santa Clara CA (US)
- Christopher Q. Ma of San Francisco CA (US)
- Zhiheng Zhou of Zhangjiagang (CN)
- Sherry Cao of San Francisco CA (US)
- Kevin M. Froese of Verona WI (US)
- Hao Xu of Cupertino CA (US)
- Hongfei Hu of Cupertino CA (US)
- Mattia Pascolini of San Francisco CA (US)
- H01Q9/04
- H01Q9/40