20240079440.Stacked multi-spectral image sensor simplified abstract (apple inc.)
Stacked multi-spectral image sensor
Organization Name
Inventor(s)
Oray O. Cellek of Los Altos CA (US)
Gershon Rosenblum of Fremont CA (US)
Hong Wei Lee of San Jose CA (US)
Cheng-Ying Tsai of San Jose CA (US)
Jae Y. Park of San Jose CA (US)
Christophe Verove of Le Cheylas (FR)
John L Orlowski of Santa Clara CA (US)
Siddharth Joshi of Grenoble (FR)
Xiangli Li of Palo Alto CA (US)
David Coulon of Aix-en-Provence (FR)
Xiaofeng Fan of San Jose CA (US)
Keith Lyon of San Jose CA (US)
Nicolas Hotellier of Jarrie (FR)
[[:Category:Arnaud Laflaqui�re of Paris (FR)|Arnaud Laflaqui�re of Paris (FR)]][[Category:Arnaud Laflaqui�re of Paris (FR)]]
Stacked multi-spectral image sensor - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240079440 titled 'Stacked multi-spectral image sensor
Simplified Explanation
The multispectral sensing device described in the abstract combines two dies, each with a different array of sensor elements, to capture optical radiation in different wavelength bands. The device includes readout circuitry to process the electrical signals generated by the sensor elements.
- The device includes a first die with a patterned array of sensor elements sensitive to wavelengths below 1000 nm.
- A second die is bonded to the first die and has a patterned array of sensor elements sensitive to wavelengths above 1000 nm.
- Readout circuitry reads the electrical signals generated by the sensor elements in both dies.
Potential Applications
The multispectral sensing device can be used in various applications such as:
- Agriculture for monitoring crop health and growth
- Environmental monitoring for analyzing water quality and pollution levels
- Remote sensing for earth observation and climate studies
Problems Solved
This technology addresses the following issues:
- Limited spectral range coverage in traditional sensors
- Inability to capture multiple wavelength bands simultaneously
- Lack of compact and integrated multispectral sensing solutions
Benefits
The benefits of this technology include:
- Enhanced spectral imaging capabilities
- Improved data collection for scientific research and analysis
- Compact and efficient design for easy integration into different systems
Potential Commercial Applications
The multispectral sensing device can be applied in commercial sectors such as:
- Aerospace and defense for surveillance and reconnaissance
- Medical imaging for diagnostic purposes
- Industrial automation for quality control and inspection processes
Possible Prior Art
One possible prior art for multispectral sensing devices is the use of separate sensors for different wavelength bands, which may lack integration and efficiency compared to the described technology.
Unanswered Questions
How does the device handle calibration and maintenance to ensure accurate and reliable performance over time?
The abstract does not provide information on the calibration process or maintenance requirements of the multispectral sensing device.
What are the power consumption and heat dissipation characteristics of the device, especially when operating in different environmental conditions?
The abstract does not mention the power consumption or thermal management aspects of the multispectral sensing device.
Original Abstract Submitted
a multispectral sensing device includes a first die, including silicon, which is patterned to define a first array of sensor elements, which output first electrical signals in response to optical radiation that is incident on the device in a band of wavelengths less than 1000 nm that is incident on the front side of the first die. a second die has its first side bonded to the back side of the first die and includes a photosensitive material and is patterned to define a second array of sensor elements, which output second electrical signals in response to the optical radiation that is incident on the device in a second band of wavelengths greater than 1000 nm that passes through the first die and is incident on the first side of the second die. readout circuitry reads the first electrical signals and the second electrical signals serially out of the device.
- Apple inc.
- Oray O. Cellek of Los Altos CA (US)
- Fei Tan of San Jose CA (US)
- Gershon Rosenblum of Fremont CA (US)
- Hong Wei Lee of San Jose CA (US)
- Cheng-Ying Tsai of San Jose CA (US)
- Jae Y. Park of San Jose CA (US)
- Christophe Verove of Le Cheylas (FR)
- John L Orlowski of Santa Clara CA (US)
- Siddharth Joshi of Grenoble (FR)
- Xiangli Li of Palo Alto CA (US)
- David Coulon of Aix-en-Provence (FR)
- Xiaofeng Fan of San Jose CA (US)
- Keith Lyon of San Jose CA (US)
- Nicolas Hotellier of Jarrie (FR)
- H01L27/146
- H04N5/378
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