20240055453. SENSOR PACKAGE STRUCTURE simplified abstract (TONG HSING ELECTRONIC INDUSTRIES, LTD.)

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SENSOR PACKAGE STRUCTURE

Organization Name

TONG HSING ELECTRONIC INDUSTRIES, LTD.

Inventor(s)

JUI-HUNG Hsu of Hsin-Chu County (TW)

CHIEN-CHEN Lee of Hsin-Chu County (TW)

LI-CHUN Hung of Hsin-Chu County (TW)

SENSOR PACKAGE STRUCTURE - A simplified explanation of the abstract

This abstract first appeared for US patent application 20240055453 titled 'SENSOR PACKAGE STRUCTURE

Simplified Explanation

The patent application describes a sensor package structure with a substrate, a sensor chip, a supporting layer, a light-permeable layer, and a grooved shielding layer.

  • The sensor chip is mounted on the substrate.
  • The supporting layer is ring-shaped and is disposed on the sensor chip.
  • The grooved shielding layer is also ring-shaped and is located on the lower surface of the light-permeable layer.
  • The grooved shielding layer includes inner and outer barriers that define a ring-shaped groove with the lower surface of the light-permeable layer.
  • The inner barrier has an opening directly above the sensing region of the sensor chip.
  • A part of the supporting layer is arranged in the ring-shaped groove.

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      1. Potential Applications
  • Medical devices
  • Environmental monitoring systems
  • Industrial process control
      1. Problems Solved
  • Protection of sensor chip from external elements
  • Enhanced sensitivity and accuracy of sensor readings
      1. Benefits
  • Improved durability of sensor package
  • Increased reliability of sensor data
  • Enhanced performance in various applications


Original Abstract Submitted

a sensor package structure is provided and includes a substrate, a sensor chip mounted on the substrate, a supporting layer being ring-shaped and disposed on the sensor chip, a light-permeable layer, and a grooved shielding layer that is ring-shaped and that is disposed on a lower surface of the light-permeable layer. the grooved shielding layer includes an inner barrier and an outer barrier respectively located at two opposite sides of the supporting layer. an inner edge of the inner barrier has an opening directly located above a sensing region of the sensor chip. the inner barrier, the outer barrier, and a part of the lower surface of the light-permeable layer jointly define a ring-shaped groove. the part of the lower surface of the light-permeable layer is disposed on the supporting layer, so that a part of the supporting layer is arranged in the ring-shaped groove.

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