20240049392. Overlap Joint Flex Circuit Board Interconnection simplified abstract (Google LLC)
Contents
Overlap Joint Flex Circuit Board Interconnection
Organization Name
Inventor(s)
John Martinis of Santa Barbara CA (US)
Bob Benjamin Buckley of Santa Barbara CA (US)
Xiaojun Trent Huang of Santa Barbara CA (US)
Overlap Joint Flex Circuit Board Interconnection - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240049392 titled 'Overlap Joint Flex Circuit Board Interconnection
Simplified Explanation
The abstract of the patent application describes an interconnection for flex circuit boards used in a quantum computing system. The interconnection involves physically coupling a first flex circuit board and a second flex circuit board together in an overlap joint, where a portion of the second side of the first flex circuit board overlaps a portion of the third side of the second flex circuit board. A signal pad structure is positioned in the overlap joint to electrically couple a first via in the first flex circuit board and a second via in the second flex circuit board.
- The interconnection for flex circuit boards in a quantum computing system involves overlapping and physically coupling two flex circuit boards together.
- A signal pad structure is used to electrically connect vias in the two flex circuit boards.
- The interconnection allows for efficient and reliable transmission of signals between the flex circuit boards.
Potential applications of this technology:
- Quantum computing systems: The interconnection can be used in quantum computing systems to connect and transmit signals between flex circuit boards.
- Electronics manufacturing: The interconnection technique can be applied in the manufacturing of various electronic devices that require flexible circuit boards.
Problems solved by this technology:
- Efficient signal transmission: The interconnection provides a reliable and efficient method for transmitting signals between flex circuit boards, ensuring proper functioning of the quantum computing system or other electronic devices.
- Space-saving design: The overlap joint allows for a compact and space-saving interconnection between the flex circuit boards.
Benefits of this technology:
- Improved reliability: The interconnection ensures a secure and stable connection between the flex circuit boards, reducing the risk of signal loss or failure.
- Enhanced flexibility: The use of flex circuit boards allows for greater flexibility in the design and layout of electronic devices.
- Cost-effective manufacturing: The interconnection technique can be implemented using existing manufacturing processes, making it a cost-effective solution for connecting flex circuit boards.
Original Abstract Submitted
an interconnection for flex circuit boards used, for instance, in a quantum computing system are provided. in one example, the interconnection can include a first flex circuit board having a first side and a second side opposite the first side. the interconnection can include a second flex circuit board having a third side and a fourth side opposite the third side. the first flex circuit board and the second flex circuit board are physically coupled together in an overlap joint in which a portion of the second side for the first flex circuit board overlaps a portion of the third side of the flex circuit board. the interconnection can include a signal pad structure positioned in the overlap joint that electrically couples a first via in the first flex circuit board and a second via in the second flex circuit board.
