20240049382. CARRIER STRUCTURE simplified abstract (SILICONWARE PRECISION INDUSTRIES CO., LTD.)

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CARRIER STRUCTURE

Organization Name

SILICONWARE PRECISION INDUSTRIES CO., LTD.

Inventor(s)

Chin-Wei Hsu of Taichung City (TW)

Jui-Kun Wang of Taichung City (TW)

Shu-Yu Ko of Taichung City (TW)

Fang-Wei Chang of Taichung City (TW)

Hsiu-Fang Chien of Taichung City (TW)

CARRIER STRUCTURE - A simplified explanation of the abstract

This abstract first appeared for US patent application 20240049382 titled 'CARRIER STRUCTURE

Simplified Explanation

The patent application describes a carrying structure with a main area and a peripheral area. The main area holds multiple packaging substrates in an array manner, while the peripheral area contains several positioning holes and positioning traces with notches along the edges of these holes. This design allows for easy alignment and insertion of positioning pins into the positioning holes.

  • The carrying structure has a main area and a peripheral area.
  • Packaging substrates are arranged in an array manner in the main area.
  • The peripheral area contains multiple positioning holes.
  • Positioning traces with notches are formed along the edges of the positioning holes.
  • The positioning traces facilitate easy alignment and insertion of positioning pins.

Potential Applications:

  • Packaging industry: This technology can be used in packaging processes where precise alignment and positioning of packaging substrates are required.

Problems Solved:

  • Alignment difficulties: The technology solves the problem of aligning and inserting positioning pins into positioning holes by providing positioning traces with notches, making the process easier and more efficient.

Benefits:

  • Improved efficiency: The design of the carrying structure simplifies the alignment and insertion process, saving time and effort.
  • Precise positioning: The positioning traces ensure accurate alignment of the packaging substrates, reducing errors and improving the overall quality of the packaging.


Original Abstract Submitted

a carrying structure is provided and is defined with a main area and a peripheral area adjacent to the main area, where a plurality of packaging substrates are disposed in the main area in an array manner, a plurality of positioning holes are disposed in the peripheral area, and a plurality of positioning traces are formed along a part of the edges of the plurality of positioning holes, such that the plurality of positioning traces are formed with notches. therefore, a plurality of positioning pins on the machine can be easily aligned and inserted into the plurality of positioning holes by the design of the plurality of positioning traces.

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