20240047407. INTEGRATED CIRCUIT PACKAGE simplified abstract (STMicroelectronics (Grenoble 2) SAS)

From WikiPatents
Jump to navigation Jump to search

INTEGRATED CIRCUIT PACKAGE

Organization Name

STMicroelectronics (Grenoble 2) SAS

Inventor(s)

Younes Boutaleb of Grenoble (FR)

Julien Cuzzocrea of Montbonnot Saint Martin (FR)

Romain Coffy of Voiron (FR)

INTEGRATED CIRCUIT PACKAGE - A simplified explanation of the abstract

This abstract first appeared for US patent application 20240047407 titled 'INTEGRATED CIRCUIT PACKAGE

Simplified Explanation

The abstract of this patent application describes an integrated circuit package that includes an electronic chip attached to a carrier substrate using an adhesive interface. The adhesive interface consists of a crown made of a first adhesive material, which is fastened around the periphery of the electronic chip's first face. The crown creates an internal housing, where a second adhesive material, different from the first material, is deposited.

  • The patent application describes an integrated circuit package with a unique adhesive interface design.
  • The adhesive interface includes a crown made of a first adhesive material that is fastened around the periphery of the electronic chip's first face.
  • The crown forms an internal housing within the integrated circuit package.
  • A second adhesive material, different from the first material, is deposited within the internal housing.

Potential Applications:

  • This technology can be used in various electronic devices that require integrated circuit packages, such as smartphones, computers, and automotive electronics.
  • It can be applied in the manufacturing of microprocessors, memory chips, and other electronic components.

Problems Solved:

  • The adhesive interface with the crown design provides improved adhesion and stability between the electronic chip and the carrier substrate.
  • It helps prevent delamination and detachment of the electronic chip during operation or under external stresses.
  • The internal housing created by the crown protects the second adhesive material from external contaminants, enhancing the reliability and longevity of the integrated circuit package.

Benefits:

  • The unique adhesive interface design improves the overall reliability and durability of the integrated circuit package.
  • It enhances the performance and functionality of electronic devices by ensuring secure attachment of the electronic chip.
  • The internal housing protects the second adhesive material, reducing the risk of damage or degradation.
  • This technology can potentially reduce manufacturing costs by improving yield rates and reducing failure rates.


Original Abstract Submitted

an integrated circuit package includes at least one electronic chip having a first face fastened onto a first face of a carrier substrate by an adhesive interface. the adhesive interface includes a crown formed of a first adhesive material that is fastened on the periphery of the first face of the electronic chip. the crown defining an internal housing. a second adhesive material, different than the first material, is deposited in the internal housing.

Retrieved from "http://wikipatents.org/index.php?title=20240047407._INTEGRATED_CIRCUIT_PACKAGE_simplified_abstract_(STMicroelectronics_(Grenoble_2)_SAS)&oldid=32830"