20240047339. INTEGRATED CIRCUIT DEVICE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
Contents
INTEGRATED CIRCUIT DEVICE
Organization Name
Inventor(s)
SEUNGMIN Song of SUWON-SI (KR)
INTEGRATED CIRCUIT DEVICE - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240047339 titled 'INTEGRATED CIRCUIT DEVICE
Simplified Explanation
The abstract describes an integrated circuit device that includes a substrate with a fin-type active region defined by a trench on the front surface. The trench is filled with a device separation layer, and a source/drain region is located on the fin-type active region. A first conductive plug is arranged on the source/drain region and connected to it. A power wiring line is partially arranged on the lower surface of the substrate, and a buried rail is connected to the power wiring line through the device separation layer. The buried rail decreases in horizontal width towards the power wiring line, and a power via connects the buried rail to the first conductive plug.
- The device includes a fin-type active region defined by a trench, allowing for compact and efficient circuit design.
- The source/drain region and first conductive plug provide electrical connectivity within the device.
- The power wiring line and buried rail enable power distribution within the integrated circuit.
- The decreasing width of the buried rail towards the power wiring line helps optimize power distribution.
- The power via connects the buried rail to the first conductive plug, facilitating power transfer.
Potential Applications
- This technology can be applied in various integrated circuit devices, such as microprocessors, memory chips, and communication devices.
- It can enhance the performance and efficiency of these devices by improving power distribution and connectivity.
Problems Solved
- The integration of the fin-type active region and the trench helps overcome space limitations and allows for more compact circuit designs.
- The buried rail and power via enable efficient power distribution within the integrated circuit, addressing power-related challenges.
Benefits
- Improved circuit design efficiency and compactness.
- Enhanced power distribution and connectivity.
- Potential for improved performance and efficiency in integrated circuit devices.
Original Abstract Submitted
an integrated circuit device includes a substrate, having a front surface and a rear surface opposite to each other, and a fin-type active region defined by a trench in the front surface, a device separation layer filling the trench, a source/drain region on the fin-type active region, a first conductive plug arranged on the source/drain region and electrically connected to the source/drain region, a power wiring line at least partially arranged on a lower surface of the substrate, a buried rail connected to the power wiring line through the device separation layer and decreasing in horizontal width toward the power wiring line, and a power via connecting the buried rail to the first conductive plug.
- SAMSUNG ELECTRONICS CO., LTD.
- SEUNGMIN Cha of SUWON-SI (KR)
- SEUNGMIN Song of SUWON-SI (KR)
- YOUNGWOO Kim of SUWON-SI (KR)
- JINKYU Kim of SUWON-SI (KR)
- SORA You of SUWON-SI (KR)
- NAMHYUN Lee of SUWON-SI (KR)
- SUNGMOON Lee of SUWON-SI (KR)
- H01L23/50
- H01L29/66
- H01L29/78
- H01L27/088
- H01L27/092
- H01L29/423
- H01L23/535
- H01L23/522
- H01L23/528