20240047336. ELECTRONIC PACKAGE simplified abstract (SILICONWARE PRECISION INDUSTRIES CO., LTD.)
Contents
ELECTRONIC PACKAGE
Organization Name
SILICONWARE PRECISION INDUSTRIES CO., LTD.
Inventor(s)
Ching-Chih Lin of Taichung City (TW)
Wen-Hsin Wang of Taichung City (TW)
Chieh-Yi Hsieh of Taichung City (TW)
Shin-Yu Wang of Taichung City (TW)
Yi-Chien Huang of Taichung City (TW)
Hsiu-Fang Chien of Taichung City (TW)
ELECTRONIC PACKAGE - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240047336 titled 'ELECTRONIC PACKAGE
Simplified Explanation
The abstract describes an electronic package that includes an electronic element arranged on a carrier structure with multiple wire-bonding pads. Bonding wires are connected to both the electrode pads of the electronic element and the wire-bonding pads. The wire-bonding pads are categorized into three groups based on their distances from the electronic element. This arrangement prevents the bonding wires from contacting each other even if they are impacted by adhesive during the packaging process, thus avoiding short circuit issues.
- The electronic package includes an electronic element and a carrier structure with wire-bonding pads.
- Bonding wires are connected to both the electronic element and the wire-bonding pads.
- The wire-bonding pads are categorized into three groups based on their distances from the electronic element.
- This arrangement prevents bonding wires from contacting each other, even if impacted by adhesive during packaging.
- The technology avoids short circuit problems caused by bonding wire contact.
Potential Applications
- Electronics manufacturing and packaging industry
- Semiconductor industry
- Integrated circuit production
Problems Solved
- Short circuit issues caused by bonding wire contact during the packaging process
Benefits
- Prevention of short circuits
- Improved reliability of electronic packages
- Enhanced performance of electronic devices
Original Abstract Submitted
an electronic package is provided, in which an electronic element is arranged on a carrier structure having a plurality of wire-bonding pads arranged on a surface of the carrier structure, and a plurality of bonding wires are connected to a plurality of electrode pads of the electronic element and the plurality of wire-bonding pads. further, among any three adjacent ones of the plurality of wire-bonding pads, a long-distanced first wire-bonding pad, a middle-distanced second wire-bonding pad and a short-distanced third wire-bonding pad are defined according to their distances from the electronic element. therefore, even if the bonding wires on the first to third wire-bonding pads are impacted by an adhesive where a wire sweep phenomenon occurred when the flowing adhesive of a packaging layer covers the electronic element and the bonding wires, the bonding wires still would not contact each other, thereby avoiding short circuit problems.
