20240047303. SEMICONDUCTOR PACKAGE STRUCTURE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
Contents
SEMICONDUCTOR PACKAGE STRUCTURE
Organization Name
Inventor(s)
Kyung Don Mun of Suwon-si (KR)
Tae-Young Lee of Suwon-si (KR)
SEMICONDUCTOR PACKAGE STRUCTURE - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240047303 titled 'SEMICONDUCTOR PACKAGE STRUCTURE
Simplified Explanation
The abstract describes a semiconductor package structure that includes a silicon substrate, multiple dies on the substrate, a mold layer between the dies, and a metal layer covering the upper side of the mold layer and part of the upper sides of each die. The metal layer has an opening that exposes the upper side of at least one die. The structure also includes a temperature controller that controls the temperature of the dies. The temperature controller has a body with a circulation region for circulating a fluid to control the temperature of the dies, and a passage part for allowing the fluid to flow into or out of the circulation region. The fluid in the circulation region is in direct contact with the exposed upper sides of the dies.
- The semiconductor package structure includes a silicon substrate, multiple dies, a mold layer, and a metal layer.
- The metal layer covers the upper side of the mold layer and part of the upper sides of each die.
- The metal layer has an opening that exposes the upper side of at least one die.
- The temperature controller controls the temperature of the dies.
- The temperature controller has a body with a circulation region for circulating a fluid.
- The temperature controller also has a passage part for allowing the fluid to flow into or out of the circulation region.
- The fluid in the circulation region is in direct contact with the exposed upper sides of the dies.
Potential applications of this technology:
- Semiconductor packaging for electronic devices
- Thermal management in integrated circuits
Problems solved by this technology:
- Ensuring proper temperature control in semiconductor devices
- Preventing overheating and thermal damage to the dies
Benefits of this technology:
- Improved performance and reliability of semiconductor devices
- Enhanced thermal management capabilities
- Increased lifespan of electronic devices
Original Abstract Submitted
a semiconductor package structure include a silicon substrate, a plurality of dies on the silicon substrate, a mold layer between the plurality of dies, a metal layer covering an upper side of the mold layer and at least a part of upper sides of each of the plurality of dies, and including an opening that exposes a part of the upper side of at least one die among the plurality of dies, and a temperature controller configured to control a temperature of the plurality of dies, the temperature controller including a body defining a circulation region configured to circulate a fluid for controlling the temperature of the plurality of dies, and a passage part configured to allow the fluid to flow into or out of the circulation region, and the fluid in the circulation region being in direct contact with exposed upper sides of the plurality of dies.
