20240047256. CENTERING WAFER FOR PROCESSING CHAMBER simplified abstract (Applied Materials, Inc.)

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CENTERING WAFER FOR PROCESSING CHAMBER

Organization Name

Applied Materials, Inc.

Inventor(s)

Muhannad Mustafa of Milpitas CA (US)

Sanjeev Baluja of Campbell CA (US)

CENTERING WAFER FOR PROCESSING CHAMBER - A simplified explanation of the abstract

This abstract first appeared for US patent application 20240047256 titled 'CENTERING WAFER FOR PROCESSING CHAMBER

Simplified Explanation

The abstract describes a patent application related to processing chambers, substrate supports, and centering wafers. The centering wafer is a disc-shaped body with a top surface, bottom surface, and a thickness. It has a center, an outer edge with an outer peripheral face, and two arc-shaped slits. The centering wafer can be used to monitor and control backside pressure, allowing for the determination of the center of a substrate support before processing.

  • The centering wafer is a disc-shaped body with a top surface, bottom surface, and a thickness.
  • It has a center, an outer edge with an outer peripheral face, and two arc-shaped slits.
  • The centering wafer can be used to monitor and control backside pressure.
  • It allows for the determination of the center of a substrate support before processing.
  • The centering wafer can be centered at different angles by rotating it.

Potential Applications:

  • Semiconductor manufacturing: The centering wafer can be used in processing chambers to ensure accurate positioning and alignment of substrates during manufacturing processes.
  • Nanotechnology: The centering wafer can be utilized in nanofabrication processes to precisely position and align nanoscale components on substrate supports.

Problems Solved:

  • Accurate centering: The centering wafer solves the problem of accurately determining the center of a substrate support, ensuring precise positioning and alignment during processing.
  • Backside pressure control: The centering wafer allows for the monitoring and control of backside pressure, which is crucial for maintaining uniformity and quality in substrate processing.

Benefits:

  • Improved manufacturing precision: The use of the centering wafer ensures accurate centering and alignment of substrates, leading to improved manufacturing precision and yield.
  • Enhanced process control: The ability to monitor and control backside pressure using the centering wafer allows for better process control and optimization.
  • Cost savings: By accurately determining the center of a substrate support, the centering wafer helps reduce material waste and improve overall process efficiency.


Original Abstract Submitted

processing chambers, substrate supports, centering wafers and methods of center calibrating wafer hand-off are described. a centering wafer comprises a disc-shaped body having a top surface and a bottom surface defining a thickness, a center, an outer edge having an outer peripheral face, a first arc-shaped slit and a second arc-shaped slit. embodiments of the disclosure advantageously provide the ability to use the centering wafer to monitor and control backside pressure and thereby determine the center of a substrate support prior to processing the centering wafer. the centering wafer may be centered at a plurality of different angles by rotating the centering wafer.

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