20240036107. TEST DEVICE simplified abstract (teCat Technologies (Suzhou) Limited)

TEST DEVICE

Organization Name

teCat Technologies (Suzhou) Limited

Inventor(s)

CHOON LEONG Lou of Suzhou City (CN)

TEST DEVICE - A simplified explanation of the abstract

This abstract first appeared for US patent application 20240036107 titled 'TEST DEVICE

Simplified Explanation

The patent application describes a test device used for testing an object under test. The device includes multiple probe assemblies, a lower substrate, an upper substrate, spacers, and shielding structures. The lower substrate is coupled to the first contact ends of the probe assemblies, while the upper substrate has through holes through which the second contact ends of the probe assemblies protrude to be electrically connected to the object under test. The resilient shielding structures are positioned between the lower and upper substrates, creating accommodating regions for the probe assemblies.

• The test device is designed to test an object under test.
• It includes multiple probe assemblies, a lower substrate, an upper substrate, spacers, and shielding structures.
• The lower substrate is connected to the first contact ends of the probe assemblies.
• The upper substrate has through holes through which the second contact ends of the probe assemblies protrude.
• The probe assemblies are electrically connected to the object under test.
• The shielding structures are resilient and positioned between the lower and upper substrates.
• The device defines accommodating regions for the probe assemblies.

Potential Applications:

• Testing electronic components or devices during manufacturing.
• Quality control testing of electronic products.
• Research and development of new electronic technologies.

Problems Solved:

• Provides a reliable and efficient method for testing objects under test.
• Ensures proper electrical connection between the probe assemblies and the object under test.
• Protects the probe assemblies from external interference or damage.

Benefits:

• Improved accuracy and reliability of testing results.
• Increased efficiency in testing processes.
• Reduced risk of damage to the probe assemblies.
• Cost-effective solution for testing electronic components.

Original Abstract Submitted

a test device for testing an object under test is provided. the test device includes a plurality of probe assemblies, a lower substrate, an upper substrate, a plurality of spacers, and a plurality of shielding structures. the lower substrate is used for being coupled to first contact ends of the plurality of probe assemblies. the upper substrate has a plurality of through holes. second contact ends of the plurality of probe assemblies protrude from the upper substrate through these through holes, so as to be electrically connected to the object under test. the plurality of shielding structures is disposed between the lower substrate and the upper substrate. the plurality of shielding structures is resilient. the upper substrate, the lower substrate and the shielding structure define a plurality of accommodating regions, and each accommodating region is used for accommodating at least one of the probe assemblies.