20240032263. ELECTRONIC APPARATUS WITH CHANNELED COOLING simplified abstract (UBICQUIA, INC.)

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ELECTRONIC APPARATUS WITH CHANNELED COOLING

Organization Name

UBICQUIA, INC.

Inventor(s)

Gustavo Dario Leizerovich of Aventura FL (US)

Ivan Quiroz of Dallas TX (US)

Glaudio Santiago Ribeiro of Evanston IL (US)

Cesar Eduardo Nunez of Miramar FL (US)

ELECTRONIC APPARATUS WITH CHANNELED COOLING - A simplified explanation of the abstract

This abstract first appeared for US patent application 20240032263 titled 'ELECTRONIC APPARATUS WITH CHANNELED COOLING

Simplified Explanation

The patent application describes an apparatus that includes a housing and at least one heat-generating electrical module. The housing has a floor and at least one sidewall portion that extends around the perimeter of the floor. The sidewall portion includes an air intake section at one end of the floor and a first air exhaust section at the other end of the floor. The floor consists of two noncoplanar floor portions and a transition portion that connects them. The transition portion, which may be angled, includes a second air exhaust section. The heat-generating modules are positioned over and spaced apart from the floor. There is at least one air flow channel defined between the inside surfaces of the floor and the external surfaces of the heat-generating modules. The apparatus may also include one or more fans that draw air in through the air intake section and force air through the air flow channels and out the air exhaust sections.

  • The apparatus includes a housing and heat-generating electrical modules.
  • The housing has a floor and sidewall portions.
  • The floor consists of two noncoplanar portions connected by a transition portion.
  • The sidewall portions have an air intake section and air exhaust sections.
  • The heat-generating modules are positioned above the floor.
  • Air flow channels are defined between the floor and the modules.
  • Fans are included to draw air in and force it through the channels.

Potential Applications:

  • Cooling electronic devices in a housing or enclosure.
  • Cooling servers or computer systems.
  • Cooling industrial equipment or machinery.

Problems Solved:

  • Preventing overheating of electrical modules.
  • Efficiently dissipating heat generated by electronic devices.
  • Ensuring proper ventilation and cooling in confined spaces.

Benefits:

  • Improved thermal management and cooling efficiency.
  • Enhanced performance and reliability of electronic devices.
  • Reduced risk of damage or malfunction due to overheating.


Original Abstract Submitted

an apparatus includes a housing and at least one heat-generating electrical module. the housing includes a floor and at least one sidewall portion extending around the floor's perimeter. the sidewall portion(s) includes an air intake section located at a first end of the floor and a first air exhaust section located at a second end of the floor. the floor includes two noncoplanar floor portions and a transition portion interconnecting them. the transition portion, which may be angled, includes a second air exhaust section. the heat-generating module(s) are positioned over and spaced apart from the floor. at least one air flow channel is defined between inside surfaces of the floor and external surfaces of the heat-generating module(s). the apparatus may also include one or more fans that draw air in through the air intake section and force air through the air flow channel(s) and out the air exhaust sections.

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