20240019331. THERMAL CONDUCTIVITY VACUUM GAUGE ASSEMBLY simplified abstract (Edwards Limited)

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THERMAL CONDUCTIVITY VACUUM GAUGE ASSEMBLY

Organization Name

Edwards Limited

Inventor(s)

Glen Croft of Burgess Hill, Sussex (GB)

Nicholas Daniel Hutton of Burgess Hill, Sussex (GB)

Gary Michael George Lord of Burgess Hill, Sussex (GB)

Matthew Gareth Key of Burgess Hill, Sussex (GB)

THERMAL CONDUCTIVITY VACUUM GAUGE ASSEMBLY - A simplified explanation of the abstract

This abstract first appeared for US patent application 20240019331 titled 'THERMAL CONDUCTIVITY VACUUM GAUGE ASSEMBLY

Simplified Explanation

The present disclosure is about a thermal conductivity vacuum gauge assembly. It consists of a body with an internal chamber for holding working gas and a heater element inside the chamber. The body has an outer facing wall surface and an opposing inner facing wall surface. The assembly also includes a thermal compensation element and a thermal equalization element that are in thermal communication with the body. The body is made of a material with a lower thermal conductivity, while the thermal equalization element is made of a material with a higher thermal conductivity.

  • The assembly is designed to measure thermal conductivity in a vacuum.
  • The body of the assembly contains a chamber for holding working gas.
  • A heater element is placed inside the chamber to generate heat.
  • The body has an outer facing wall surface and an inner facing wall surface.
  • A thermal compensation element and a thermal equalization element are in thermal communication with the body.
  • The body is made of a material with lower thermal conductivity.
  • The thermal equalization element is made of a material with higher thermal conductivity.

Potential applications of this technology:

  • Vacuum systems and processes that require accurate measurement of thermal conductivity.
  • Industrial applications where vacuum conditions need to be monitored and controlled.
  • Research and development in fields such as materials science, semiconductor manufacturing, and aerospace.

Problems solved by this technology:

  • Provides a reliable and accurate method for measuring thermal conductivity in a vacuum.
  • Allows for better control and optimization of vacuum processes.
  • Helps identify and troubleshoot issues related to thermal conductivity in vacuum systems.

Benefits of this technology:

  • Improved efficiency and performance of vacuum systems.
  • Enhanced process control and optimization.
  • Cost savings through better monitoring and maintenance of vacuum processes.
  • Facilitates research and development in various industries.


Original Abstract Submitted

the present disclosure relates to a thermal conductivity vacuum gauge assembly. the assembly comprises a body defining an internal chamber for receiving working gas and a heater element disposed within the chamber. the body is defined by a wall having an outer facing wall surface and an opposing inner facing wall surface. a thermal compensation element and a thermal equalisation element are in thermal communication with the body. the body is made of a material with a first thermal conductivity, and the thermal equalisation element is made of a material with a second thermal conductivity that is higher than the first thermal conductivity. the present disclosure also relates to a thermal conductivity vacuum gauge including the assembly.

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