20240018649. Powder-Surface Treatment Apparatus simplified abstract (Hyundai Motor Company)
Contents
Powder-Surface Treatment Apparatus
Organization Name
Inventor(s)
Seung Jeong Oh of Hwaseong-si (KR)
Woong Pyo Hong of Suwon-si (KR)
Jung Yeon Park of Hwaseong-si (KR)
Chae Woong Kim of Daejeon (KR)
Powder-Surface Treatment Apparatus - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240018649 titled 'Powder-Surface Treatment Apparatus
Simplified Explanation
The embodiment powder-surface treatment apparatus described in the patent application consists of a housing with an internal space. Within this internal space, there is a main chamber that defines an accommodation space where a surface treatment process using ald (atomic layer deposition) can be performed. The apparatus also includes an injection unit located at one end of the main chamber, a stack of sub-chambers arranged in a multi-step configuration along the accommodation space, with each sub-chamber filled with powder, a discharging unit at the other end of the main chamber, a loading apparatus to add a new sub-chamber into the accommodation space, and an unloading apparatus to remove and discharge one or more sub-chambers from the accommodation space to the outside.
- The apparatus is designed to perform surface treatment processes using atomic layer deposition (ALD).
- It includes a main chamber that provides an accommodation space for the treatment process.
- The main chamber has an injection unit for introducing the necessary materials.
- Multiple sub-chambers are stacked in a multi-step configuration, each filled with powder.
- The apparatus has a discharging unit to remove treated sub-chambers.
- A loading apparatus is used to add new sub-chambers into the accommodation space.
- An unloading apparatus is used to remove and discharge sub-chambers from the accommodation space.
Potential applications of this technology:
- Surface treatment of various materials using atomic layer deposition.
- Coating or modifying the surface properties of objects or substrates.
- Semiconductor manufacturing processes.
- Nanotechnology research and development.
Problems solved by this technology:
- Efficient and controlled surface treatment using atomic layer deposition.
- Simplified loading and unloading of sub-chambers for continuous operation.
- Improved process scalability and flexibility.
- Enhanced control over the surface treatment process.
Benefits of this technology:
- Precise and uniform surface treatment.
- Increased productivity and throughput.
- Reduced downtime for loading and unloading.
- Improved process control and repeatability.
- Potential for cost savings in surface treatment processes.
Original Abstract Submitted
an embodiment powder-surface treatment apparatus includes a housing defining an internal space, a main chamber installed in the internal space and defining an accommodation space in which a surface treatment process is performable using ald, an injection unit provided on a first end portion of the main chamber, a plurality of sub-chambers arranged in a stack on top of each other in a multi-step configuration along the accommodation space in the main chamber in a state where an internal space in each of the plurality of sub-chambers is filled with a powder, a discharging unit provided on a second end portion of the main chamber, a loading apparatus configured to load a new sub-chamber into the accommodation space in the main chamber, and an unloading apparatus configured to unload and discharge at least one of the plurality of sub-chambers from the accommodation space to the outside.
