20240014167. SUBSTRATE HOLDER AND BONDING SYSTEM simplified abstract (SHINKAWA LTD.)

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SUBSTRATE HOLDER AND BONDING SYSTEM

Organization Name

SHINKAWA LTD.

Inventor(s)

Kohei Seyama of Tokyo (JP)

SUBSTRATE HOLDER AND BONDING SYSTEM - A simplified explanation of the abstract

This abstract first appeared for US patent application 20240014167 titled 'SUBSTRATE HOLDER AND BONDING SYSTEM

Simplified Explanation

The abstract describes a bonding system with a bonding device and a substrate holder. The bonding device has a stage that suctions the substrate holder onto a placement surface. The substrate holder consists of a plate-shaped base and a positioning member that defines the position of the individual substrates. The base has an upper surface for placing the substrates and a lower surface that is fixed by suction onto the placement surface.

  • The bonding system includes a bonding device and a substrate holder.
  • The bonding device has a stage that suctions the substrate holder onto a placement surface.
  • The substrate holder consists of a plate-shaped base and a positioning member.
  • The positioning member defines the position of the individual substrates.
  • The base has an upper surface for placing the substrates and a lower surface that is fixed by suction onto the placement surface.

Potential Applications:

  • Semiconductor chip bonding: This technology can be used for bonding semiconductor chips to individual substrates, ensuring precise positioning and secure attachment.

Problems Solved:

  • Precise positioning: The positioning member on the substrate holder helps define the exact position of the individual substrates, ensuring accurate bonding.
  • Secure attachment: The suction-based fixation of the substrate holder onto the placement surface ensures a stable and secure bonding process.

Benefits:

  • Improved accuracy: The positioning member and suction-based fixation enable precise and repeatable positioning of the substrates, resulting in improved bonding accuracy.
  • Enhanced stability: The suction-based fixation of the substrate holder provides a stable platform for bonding, reducing the risk of misalignment or movement during the process.
  • Time and cost savings: The efficient bonding system allows for faster and more reliable bonding, leading to increased productivity and cost savings in semiconductor manufacturing.


Original Abstract Submitted

a bonding system () is provided with a bonding device () for bonding semiconductor chips () to individual substrates (), and a substrate holder () for holding the individual substrates (), the bonding device () being provided with a stage () for fixing, by suction, the substrate holder () on a placement surface (), the substrate holder () being provided with a plate-shaped base () and a positioning member () that is provided on the base () and that defines the position of the individual substrates (), the base () having an upper surface () on which the individual substrates () are placed and a lower surface () that is fixed by suction onto the placement surface ().

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