18968954. DAM LAMINATE ISOLATION SUBSTRATE (Texas Instruments Incorporated)
Contents
DAM LAMINATE ISOLATION SUBSTRATE
Organization Name
Texas Instruments Incorporated
Inventor(s)
Chang-Yen Ko of New Taipei City TW
Chung-Ming Cheng of New Taipei City TW
Megan Chang of New Taipei City TW
Chih-Chien Ho of New Taipei City TW
DAM LAMINATE ISOLATION SUBSTRATE
This abstract first appeared for US patent application 18968954 titled 'DAM LAMINATE ISOLATION SUBSTRATE
Original Abstract Submitted
An apparatus includes a lead frame, a dam and adhesive on portions of the lead frame, and an integrated circuit die having a portion on the dam and another portion on the adhesive. The lead frame can include two portions, or two lead frames. The dam can bridge a space between the two lead frames. The dam can be smaller than the integrated circuit die in at least a width dimension of the dam relative to a width dimension of the integrated circuit die, providing that the integrated circuit die overhangs the dam on each side of the width dimension of the dam. Adhesive is located between the integrated circuit die and each lead frame, adjacent to and on each side of the dam. The dam prevents adhesive from spreading into the space between the lead frames.
