18963083. SEMICONDUCTOR DEVICE (Murata Manufacturing Co., Ltd.)

SEMICONDUCTOR DEVICE

Organization Name

Murata Manufacturing Co., Ltd.

Inventor(s)

Mari Saji of Nagaokakyo-shi (JP)

Atsushi Kurokawa of Nagaokakyo-shi (JP)

Hiroshi Yamada of Nagaokakyo-shi (JP)

SEMICONDUCTOR DEVICE

This abstract first appeared for US patent application 18963083 titled 'SEMICONDUCTOR DEVICE

Original Abstract Submitted

At least one of transistors is in a device layer. A plurality of bumps are on one surface of the device layer. An insulating layer is on a surface of the device layer opposite to the surface having the plurality of bumps. The heat transfer layer is in contact with a surface of the insulating layer opposite to a surface on which the device layer is disposed. The heat transfer layer is formed of an insulating material having a thermal conductivity higher than a thermal conductivity of the insulating layer. When the device layer is viewed in plan view, one first transistor of the transistors includes a non-overlapping portion which is a portion not overlapping with the plurality of bumps, and the heat transfer layer is continuous from a portion overlapping with the non-overlapping portion to a portion overlapping with at least one of the plurality of bumps.