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18907141. CYCLIC PEALD/PECVD THIN FILM ENCAPSULATION BARRIER (Applied Materials, Inc.)

From WikiPatents

CYCLIC PEALD/PECVD THIN FILM ENCAPSULATION BARRIER

Organization Name

Applied Materials, Inc.

Inventor(s)

Wenhui Li of Santa Clara CA US

Kevin Chen of Santa Clara CA US

Wen-Hao Wu of San Jose CA US

Yu-Min Wang of Santa Clara CA US

Zongkai Wu of Santa Clara CA US

Kwang Soo Huh of Palo Alto CA US

Lai Zhao of Campbell CA US

CYCLIC PEALD/PECVD THIN FILM ENCAPSULATION BARRIER

This abstract first appeared for US patent application 18907141 titled 'CYCLIC PEALD/PECVD THIN FILM ENCAPSULATION BARRIER

Original Abstract Submitted

Embodiments described herein relate to an optical device and methods of forming an optical device. The optical device includes a substrate, an illumination source, a capping layer, an encapsulation layer, and a passivation layer. The encapsulation layer includes a first atomic layer deposition (ALD) layer, a chemical vapor deposition (CVD) layer, and a second ALD layer. The method includes disposing a capping layer over an illumination layer, the illumination layer disposed over a substrate in a processing chamber; disposing a first atomic layer deposition (ALD) layer over the capping layer; disposing a chemical vapor deposition (CVD) layer over the first ALD layer; disposing a second ALD layer over the CVD layer; and disposing a passivation layer over the second ALD layer.