18888246. SEMICONDUCTOR DEVICE WITH SOLDER ON PILLAR (TEXAS INSTRUMENTS INCORPORATED)
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SEMICONDUCTOR DEVICE WITH SOLDER ON PILLAR
Organization Name
TEXAS INSTRUMENTS INCORPORATED
Inventor(s)
Rafael Jose Guevara of Pampanga (PH)
SEMICONDUCTOR DEVICE WITH SOLDER ON PILLAR
This abstract first appeared for US patent application 18888246 titled 'SEMICONDUCTOR DEVICE WITH SOLDER ON PILLAR
Original Abstract Submitted
A semiconductor die includes a substrate including a semiconductor surface including circuitry electrically connected to die bond pads that include a first die bond pad exposed by a passivation layer, a top dielectric layer over the passivation layer, and a metal layer electrically connected to the first die bond pad. A pillar is on the metal layer over the first die bond pad, and a solder cap is on a top side of the pillar. The solder cap includes an essentially vertical sidewall portion generally beginning at a top corner edge of the pillar.
