18887837. SEMICONDUCTOR DEFECT INSPECTION METHOD AND APPARATUS (Hyundai Motor Company)
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SEMICONDUCTOR DEFECT INSPECTION METHOD AND APPARATUS
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SEMICONDUCTOR DEFECT INSPECTION METHOD AND APPARATUS
This abstract first appeared for US patent application 18887837 titled 'SEMICONDUCTOR DEFECT INSPECTION METHOD AND APPARATUS
Original Abstract Submitted
A method and an apparatus for inspecting defects in semiconductors may be incorporated in a vehicle production process. The apparatus includes an exterior inspection unit for inspecting an exterior of a semiconductor, a function inspection unit for inspecting functions of the semiconductor, a first ultrasonic inspection unit for performing a first ultrasonic inspection on the semiconductor, a pretreatment tester for performing a pretreatment on the semiconductor when the first ultrasonic inspection has been completed, a second ultrasonic inspection unit for performing a second ultrasonic inspection on the semiconductor when the pretreatment has been completed, and a cross-sectional inspection unit for inspecting a cross-section of the semiconductor when the second ultrasonic inspection shows that delamination has increased after the pretreatment.
