18885764. SEMICONDUCTOR PACKAGE HAVING DISCRETE ANTENNA DEVICE (MEDIATEK INC.)
Contents
SEMICONDUCTOR PACKAGE HAVING DISCRETE ANTENNA DEVICE
Organization Name
Inventor(s)
Wen-Chou Wu of Hsinchu City (TW)
Yi-Chieh Lin of Hsinchu City (TW)
Chia-Yu Jin of Hsinchu City (TW)
Hsing-Chih Liu of Hsinchu City (TW)
SEMICONDUCTOR PACKAGE HAVING DISCRETE ANTENNA DEVICE
This abstract first appeared for US patent application 18885764 titled 'SEMICONDUCTOR PACKAGE HAVING DISCRETE ANTENNA DEVICE
Original Abstract Submitted
A semiconductor package includes a first package having a first side and a second side opposing the first side. The first package comprises a first electronic component and a second electronic component arranged in a side-by-side manner on the second side. A second package is mounted on the first side of the first package. The second package comprises a radiative antenna element. A connector is configured to electrically couple to a G modem through a flex cable and is disposed on the second side.
