18755000. SOLID-STATE IMAGING DEVICE AND ELECTRONIC APPARATUS simplified abstract (SONY SEMICONDUCTOR SOLUTIONS CORPORATION)

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SOLID-STATE IMAGING DEVICE AND ELECTRONIC APPARATUS

Organization Name

SONY SEMICONDUCTOR SOLUTIONS CORPORATION

Inventor(s)

Itaru Oshiyama of Kanagawa (JP)

Shinichiro Noudo of Kumamoto (JP)

Yasufumi Miyoshi of Kanagawa (JP)

SOLID-STATE IMAGING DEVICE AND ELECTRONIC APPARATUS - A simplified explanation of the abstract

This abstract first appeared for US patent application 18755000 titled 'SOLID-STATE IMAGING DEVICE AND ELECTRONIC APPARATUS

The abstract of the patent application describes a technology where groove portions are present between adjacent photoelectric conversion portions. The sidewall surfaces and bottom surfaces of the groove portions are covered with a first fixed charge film, while the open ends of the groove portions are closed by a second fixed charge film with voids inside.

  • Groove portions are provided between adjacent photoelectric conversion portions.
  • Sidewall surfaces and bottom surfaces of the groove portions are covered with a first fixed charge film.
  • Open ends of the groove portions are closed by a second fixed charge film with voids inside.

Potential Applications: This technology could be applied in the development of advanced photoelectric conversion devices, such as sensors or imaging systems.

Problems Solved: This technology helps in improving the efficiency and performance of photoelectric conversion devices by providing a protective and charge-enhancing structure within the device.

Benefits: Enhanced charge retention, improved device performance, and increased durability are some of the key benefits of this technology.

Commercial Applications: This technology could find applications in industries such as electronics, imaging, and sensor technology, where high-performance photoelectric conversion devices are required.

Questions about the Technology: 1. How does the use of fixed charge films improve the performance of photoelectric conversion devices? 2. What are the potential challenges in implementing this technology in commercial devices?


Original Abstract Submitted

Groove portions are provided between adjacent photoelectric conversion portions, and sidewall surfaces and bottom surfaces of the groove portions are covered with a first fixed charge film, and open ends of the groove portions are closed by a second fixed charge film with voids inside of the groove portions.