18754605. SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
Contents
SEMICONDUCTOR PACKAGE
Organization Name
Inventor(s)
KYONG HWAN Koh of Suwon-si (KR)
JONGWAN Kim of Cheonan-si (KR)
YONGKWAN Lee of Hwaseong-si (KR)
SEMICONDUCTOR PACKAGE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18754605 titled 'SEMICONDUCTOR PACKAGE
The semiconductor package described in the patent application consists of a base substrate with metal line patterns on both surfaces, vias connecting the patterns, a semiconductor chip, and a molding member covering the chip and first surface. The base substrate features recesses at corners, filled by protrusions in the molding member.
- Base substrate with metal line patterns on both surfaces
- Vias connecting the metal line patterns
- Recesses at corners of the base substrate
- Protrusions in the molding member filling the recesses
- Semiconductor chip mounted on the first surface
Potential Applications: - Semiconductor packaging industry - Electronics manufacturing
Problems Solved: - Enhanced protection for semiconductor chips - Improved connectivity between metal line patterns
Benefits: - Increased durability and reliability of semiconductor packages - Better performance due to improved connectivity
Commercial Applications: Title: Advanced Semiconductor Packaging Technology This technology can be used in various industries such as consumer electronics, automotive, telecommunications, and more. It can lead to more robust and efficient electronic devices, enhancing their overall performance and longevity.
Questions about Semiconductor Packaging Technology: 1. How does this technology improve the durability of semiconductor packages?
- The technology enhances protection for semiconductor chips through the use of recesses and protrusions in the molding member, increasing the overall durability of the package.
2. What are the potential applications of this advanced semiconductor packaging technology?
- This technology can be applied in various industries such as consumer electronics, automotive, and telecommunications, where durable and reliable semiconductor packages are essential for optimal device performance.
Original Abstract Submitted
A semiconductor package includes a base substrate that includes a first surface and a second surface that face each other, a plurality of first metal line patterns disposed on the first surface, a plurality of second metal line patterns disposed on the second surface, a plurality of vias that penetrate the base substrate and connect the first metal line patterns to the second metal line patterns, a semiconductor chip disposed on the first surface, and a molding member that covers the first surface and the semiconductor chip. The base substrate includes at least one recess at a corner of the base substrate. The recess extends from the first surface toward the second surface. The molding member includes a protrusion that fills the recess.
