18749516. PACKAGE STRUCTURE simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)

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PACKAGE STRUCTURE

Organization Name

TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.

Inventor(s)

Shih-Ting Lin of Taipei City (TW)

Chi-Hsi Wu of Hsinchu City (TW)

Chen-Hua Yu of Hsinchu City (TW)

Szu-Wei Lu of Hsinchu City (TW)

PACKAGE STRUCTURE - A simplified explanation of the abstract

This abstract first appeared for US patent application 18749516 titled 'PACKAGE STRUCTURE

The abstract describes a package structure that includes semiconductor dies, an insulating encapsulant, a redistribution layer, and connecting elements. The encapsulant surrounds the semiconductor dies, while the redistribution layer is electrically connected to the dies and includes conductive lines, vias, and dielectric layers. The connecting elements join the redistribution layer and the semiconductor dies.

  • The package structure consists of semiconductor dies, an insulating encapsulant, a redistribution layer, and connecting elements.
  • The encapsulant surrounds the semiconductor dies to protect them.
  • The redistribution layer is electrically connected to the semiconductor dies and includes conductive lines, vias, and dielectric layers.
  • The connecting elements bridge the gap between the redistribution layer and the semiconductor dies.
  • The lateral dimension of the vias in the redistribution layer increases along the build-up direction, while the lateral dimension of the via portion of the connecting elements decreases in the same direction.

Potential Applications: - This technology can be applied in the manufacturing of advanced semiconductor packages. - It can be used in the development of high-performance electronic devices.

Problems Solved: - Provides a reliable and efficient way to connect semiconductor dies within a package structure. - Enhances the electrical connectivity and performance of semiconductor devices.

Benefits: - Improved reliability and performance of semiconductor packages. - Enhanced electrical connectivity between semiconductor dies. - Increased efficiency in the manufacturing process of electronic devices.

Commercial Applications: Title: Advanced Semiconductor Package Structure for High-Performance Electronic Devices This technology can be utilized in the production of high-performance electronic devices such as smartphones, tablets, and computers. It can also benefit industries that require advanced semiconductor packaging solutions.

Questions about the technology: 1. What are the key components of the package structure described in the abstract? 2. How does the lateral dimension of the vias in the redistribution layer impact the overall performance of the semiconductor package?


Original Abstract Submitted

A package structure includes a plurality of semiconductor dies, an insulating encapsulant, a redistribution layer and a plurality of connecting elements. The insulating encapsulant is encapsulating the plurality of semiconductor dies. The redistribution layer is disposed on the insulating encapsulant in a build-up direction and electrically connected to the plurality of semiconductor dies, wherein the redistribution layer includes a plurality of conductive lines, a plurality of conductive vias and a plurality of dielectric layers alternately stacked, and a lateral dimension of the plurality of conductive vias increases along the build-up direction. The connecting elements are disposed in between the redistribution layer and the semiconductor dies, wherein the connecting elements includes a body portion joined with the semiconductor dies and a via portion joined with the redistribution layer, wherein a lateral dimension of the via portion decreases along the build-up direction.

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